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3D PLUS a plus de 210 000 composants microélectroniques dans l’espace, et plus de 25 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
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The DDR4s inherit 3D PLUS’s experience as space memory supplier and manufacturer from SRAM, SDRAM, DDR1, DDR2 to DDR3.
DDR4 SDRAM features higher speed and lower consumption than DDR3 SDRAM. From 16 Gb to 64 Gb, the Radiation Tolerant DDR4 SDRAM modules are organized as x48b or x72b, and with a 1.2 V power supply. Similar to the DDR3 memories, the DDR4s feature an optimized design with decoupling capacitors and termination resistors embedded in the module. They are offered in BGA package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.
The DDR4 SDRAM products for space applications are used as processing memories alongside the latest processors, FPGAs, in a variety of computer boards. They operate synergistically in an Ecosystem with two additional elements, providing a space qualified DDR4 solution that is unmatched in terms of performances and radiation reliability. The DDR4 memory companion chips are:
Vdd/Vddq= 1.2 V, Vpp = 2.5 V
Up to 2400 MT/s
Decoupling capacitors and termination resistors embedded
Significant board area savings
Optimized development time and cost
Ruggedized, fully validated complete DDR4 solution
Long life cycle products with proven reliability in Space
No pure tin guarantee
Radiation tolerance (stand alone):
TID > 100 krad(Si)
SEL LETth > 62.8 MeV.cm²/mg
SEU LETth > 2.6 MeV.cm²/mg ; σsat = 4E-12 cm²/bit
SEFI LETth < 2.6 MeV.cm²/mg ; σsat = 5E-5cm²/device
Radiation tolerance (w. RIMC DDR4):
TID > 100 krad (Si)
SEL LET > 62.8 MeV.cm²/mg
SEU/SERE/SECE/SEFI mitigation with 3DIPMC0815
Available in all 3D PLUS screening and qualification options:
Commercial (C )
Industrial (I)
Space qualified (S)
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information. Memory Part Number Decoder
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.