RTIMS Flash: User-Friendly Radiation-Protected NAND Flash Memory

Discover the Radiation Intelligent Memory Stack (RTIMS) Flash, a user-friendly, high-density, plug-and-play NAND Flash memory designed to provide radiation protection. This cutting-edge memory solution features an embedded Flash Memory Controller (FMC) and NAND Flash memories.

The NAND Flash memories used in RTIMS Flash are SLC-based, ensuring high performance and immunity to latch-up. The FMC offers comprehensive protection against Single Event Upsets (SEUs) through either Triple Modular Redundancy (TMR) or Error Detection And Correction (EDAC) methods. Additionally, the FMC includes current detection and power management to safeguard against high-current SEFi events.

First released in 2014, RTIMS Flash operates as a standard NAND Flash when connected to any processor or FPGA with a built-in NAND Flash interface. It is also widely used as a stand-alone local data recorder, thanks to its embedded functions like wear leveling and bad block management.

Explore the capabilities of RTIMS Flash for reliable, radiation-protected data storage in a variety of applications.

Key features

  • SLC memory technology

    Bad block free – continuous logic sectors

    100, 000 program/erase cycles capability

    10 years data retention

  • Radiation tolerance:

    TID > 50 krad (Si)

    SEL LETth > 62.5 MeV.cm²/mg

    SEU Immune (TMR or EDAC)

    SET Immune by design

    High Current SEFI Immune by design

  • No pure tin guarantee

    Flight heritage with technology proven for 15 to 18 years missions in space

    Worldwide delivery guarantee

Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The  screening level

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.

Memory Part Number Decoder

Density Part Number Description Package Temperature
24 Gb 3DSS24G08VS3626 Access time:
99 Mb/s write mode
287 Mb/s read mode
Asynchronous only
SOP 38 -40 °C to +85 °C
64 Gb 3DSS64G08US2818 Access time:
217 Mb/s write mode
1029 Mb/s read mode
Asynchronous and synchronous
SOP 52 -55 °C to +105 °C


Design Tools

Design Tools

24 Gb

3DSS24G08VS3626 - Assembly Recommendations PDF - 822 ko Télécharger
3DSS24G08VS3626 - Footprint PDF - 277 ko Télécharger

64 Gb

3DSS64G08US2818 - Assembly Recommendations PDF - 822 ko Télécharger
3DSS64G08US2818 - Footprint PDF - 608 ko Télécharger


Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.

Density Part Number Flyer / Data sheet
24 Gb 3DSS24G08VS3626 Flyer / Data sheet PDF - 1853ko Télécharger
64 Gb 3DSS64G08US2818 Flyer / Data sheet PDF - 1368ko Télécharger