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3D PLUS a plus de 210 000 composants microélectroniques dans l’espace, et plus de 25 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
Demande d'information
Our Radiation Tolerant SPI NOR Flash are latchup immune, 3.3 V powered memories featuring small pin count and serial interface. They also offer no bad block, high endurance and long time data retention. They are offered in SOP package for high resistance Surface Mount (SMT) assembly and for withstanding harsh thermal and mechanical environments.
This product line is split into two sub-families:
First released in 2018, 3D PLUS SPI NOR Flash are used as configuration memory for SRAM-based FPGAs or as boot/program memory for leading processors. These memory modules have been used on missions such as EMIT and others.
Up to 133 MHz for QSPI, 50 MHz for TMR modules
Small footprint
Radiation tolerance for QSPI modules:
TID > 20 krad(Si)
SEL LETth > 62.5 MeV.cm²/mg
SEU LETth > 15.0 MeV.cm²/mg; σsat = 7.5e-11 cm²/bit
Available in all 3D PLUS screening and qualification options:
Commercial (C )
Industrial (I)
Space qualified (S)
20 years data retention
100, 000 erase/program cycles
Radiation tolerance for TMRed modules:
TID > 20 krad (Si) mode ON
TID > 40 krad(Si) mode OFF
SEU Immune by TMR
Long life cycle products with proven reliability in Space
No pure tin guarantee
Large and worldwide flight heritage
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
EMIT goal is to map the world’s mineral-dust sources, gather information about particle color and composition. Thus to improve climate comprehension and modelling.