3D PLUS a plus de 200 000 composants microélectroniques dans l’espace, et plus de 20 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
The Space Camera Head family provides high resolution and high performance camera heads for space applications. Integrated using 3D PLUS packaging technology, each camera head embeds a high performance image sensor associated user-reconfigurable FPGA-based electronic architecture, allowing configurable embedded image processing and formatting for a versatile use.
The 1.3Mpx SWIR Space Camera Head embeds all necessary components to operate its InGaAs SWIR image sensor and high performance FPGA-based architecture in a highly constrained space environment, including all DC-DC converters, processing and storage memories in a reduced volume of 40x40x45mm3. This camera module offers a configurable electrical interface through a 77-pins PGA matrix, including 22 LVDS pairs, a JTAG interface for FPGA configuration, and a 5V power supply interface, and compatible to the 12Mpx Space Camera Head. The 1.3Mpx SWIR Space Camera Head design provides to the users a dedicated optical, mechanical and thermal interface for an optimal and easy integration in space optical instruments as well as a second thermal interface dedicated to the processing architecture, allowing a efficient separation between the sensing part and the processing part of the camera head.
The 1.3Mpx SWIR Space Camera head is a generic product, suitable for multiple high performance space applications requiring SWIR sensibility such ass scientific imaging (spectrometry, planetology), earth observation, navigation and rendezvous applications in constrained light environment.
All-in-one space qualified High resolution and high performance camera head :
High level of miniaturization and optimization :
Enhanced radiation performances :
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Camera Part Number Decoder
Camera evaluation kits are ready to use evaluation and prototyping environment compatible with 3D PLUS camera heads products, including hardware and software tools to support the use and integration of the camera heads. It allows configuration and operating of the camera heads in a test environment (instrument integration, optical bench, testing facilities).
3D PLUS space camera heads family offers several options for the configuration of its cameras, all compliant with ECSS-QST-60-02C ESA development standard
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.