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OVERVIEW : DDR4 SDRAM Space Qualified Memory

The DDR4s inherit 3D PLUS’s experience as space memory supplier and manufacturer from SRAM, SDRAM, DDR1, DDR2 to DDR3.

DDR4 SDRAM features higher speed and lower consumption than DDR3 SDRAM. From 16 Gb to 64 Gb, the Radiation Tolerant DDR4 SDRAM modules are organized as x48b or x72b, and with a 1.2 V power supply. Similar to the DDR3 memories, the DDR4s feature an optimized design with decoupling capacitors and termination resistors embedded in the module.  They are offered in BGA package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.

The DDR4 Space Memory Ecosystem

The DDR4 SDRAM products for space applications are used as processing memories alongside the latest processors, FPGAs, in a variety of computer boards. They operate synergistically in an Ecosystem with two additional elements, providing a space qualified DDR4 solution that is unmatched in terms of performances and radiation reliability. The DDR4 memory companion chips are:

  • The Radiation Intelligent Memory Controller (RIMC) for DDR4 (3DIPMC0815) is a fully configurable DDR4 SDRAM memory controller designed to work with 3D PLUS DDR4 modules to provide an overall radiation hardened memory solution. This IP core offers Single Event Upset (SEU) and Single Event Functional Interrupt (SEFI) mitigation to DDR4 operating in radiation-hazard environments.
  • A radiation hardened by design Termination Regulator DDR4 TR (3DPM0424). This companion chip provides all power requirements for DDR4 VTT bus designs. It reduces power dissipation while dramatically improving signal integrity.

Key features

  • Vdd/Vddq= 1.2 V, Vpp = 2.5 V

    Up to 2400 MT/s

  • Decoupling capacitors and termination resistors embedded

    Significant board area savings

    Optimized development time and cost

  • Ruggedized, fully validated complete DDR4 solution

    Long life cycle products with proven reliability in Space

    No pure tin guarantee

  • Radiation tolerance (stand alone):

    TID > 100 krad(Si)

    SEL LETth > 62.8 MeV.cm²/mg

    SEU LETth > 2.6 MeV.cm²/mg ;
    σsat = 4E-12 cm²/bit

    SEFI LETth < 2.6 MeV.cm²/mg ;
    σsat = 5E-5cm²/device

  • Radiation tolerance (w. RIMC DDR4):

    TID > 100 krad (Si)

    SEL LET > 62.8 MeV.cm²/mg

    SEU/SERE/SECE/SEFI mitigation with 3DIPMC0815

  • Available in all 3D PLUS screening and qualification options:

    Commercial (C )

    Industrial (I)

    Space qualified (S)

Line Up

Radiation Tolerant DDR4 Space Memory Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The screening level

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Density Part Number Description Package Temperature
64 Gb 3D4D64G80LB2860 1G x80
2400 MT/s
BGA 363 -55 °C to +105 °C
48 Gb 3D4D48G48LB2825 1G x48
2400 MT/s
BGA 259 -55 °C to +105 °C
32 Gb 3D4D32G72LB2805 512M x72
2400 MT/s
BGA 259 -55 °C to +105 °C
24 Gb 3D4D24G48LB2833 512M x48
2400 MT/s
BGA 259 -55 °C to +105 °C
16 Gb 3D4D16G72LB2832 256M x72
2400 MT/s
BGA 259 -55 °C to +105 °C

 

Design Tools

Design Tools

16 Gb

3D4D16G72LB2832 - Assembly Recommendations PDF - 1452 ko Download
3D4D16G72LB2832 - Footprint PDF - 1875 ko Download

24 Gb

3D4D24G48LB2833 - Assembly Recommendations PDF - 1452 ko Download
3D4D24G48LB2833 - Footprint PDF - 1862 ko Download

32 Gb

3D4D32G72LB2805 - Assembly Recommendations PDF - 1452 ko Download
3D4D32G72LB2805 - Footprint PDF - 848 ko Download

48 Gb

3D4D48G48LB2825 - Assembly Recommendations PDF - 1452 ko Download
3D4D48G48LB2825 - Footprint PDF - 1862 ko Download

64 Gb

3D4D64G80LB2860 - Assembly Recommendations - 0 ko Download
3D4D64G80LB2860 - Footprint PDF - 829 ko Download

Documentation

Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.

Density Part Number Data Sheet Unused pins Decoupling capacitor
16 Gb 3D4D16G72LB2832 Data Sheet PDF - 2768ko Download Unused pins PDF - 148ko Download Decoupling capacitor PDF - 273ko Download
32 Gb 3D4D32G72LB2805 Data Sheet PDF - 3273ko Download Unused pins PDF - 148ko Download Decoupling capacitor PDF - 276ko Download
24 Gb 3D4D24G72LB2833 Data Sheet PDF - 2321ko Download Unused pins PDF - 148ko Download Decoupling capacitor PDF - 355ko Download
48 Gb 3D4D48G48LB2825 Data Sheet PDF - 3322ko Download Unused pins PDF - 148ko Download Decoupling capacitor PDF - 358ko Download
64 Gb 3D4D64G80LB2860 Data Sheet PDF - 2839ko Download Unused pins PDF - 148ko Download Decoupling capacitor