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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS is the world-leading supplier of advanced high-density 3D electronic products, bare die and wafer level stacking technology meeting the demand for high reliability.
Application
Aerospace
Defense & Security
Inventor of 3D stacked Electronics for Space
High quality Referential with ISO and Space Agencies certifications
Our Support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, system in packages, miniaturized
Over 25 years of flight heritage and more than 200 000 modules in Space.
Expertise in obsolescence management and long term supply
3D PLUS is introducing 3DSD1G48VB2820, a new memory, to broaden their portfolio of space SDRAMs.
3D PLUS is thrilled to announce that the Chinese Chang´e 6 space mission, lunar landing on June 2nd 2024, marks the first space flight heritage for our component FUSIO RT which integrates the NG-MEDIUM FPGA from NanoXplore.
3D PLUS proudly extends its congratulations to the entire team at the Centre Spatial Universitaire de Montpellier (CSUM) for the outstanding success of the ROBUSTA-3A mission.
