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Overview: Enhance Your Space Systems Electronics with 3D PLUS Radiation-Tolerant Nor Flash

3D PLUS offers state-of-the-art NOR Flash stacks powered at 3.3V, specifically designed for space applications. These high-density, high-speed Non-Volatile memories stand out due to their exceptional performance and reliability. With x8b or x16b data bus width  and an asynchronous parallel interface, the NOR Flash provides zero bad block, ensuring exceptional endurance and long-term data retention. Packaged in SOP for high resistance Surface Mount (SMT) assembly, these modules are built to withstand harsh thermal and mechanical conditions, such as the space environment.

Since their introduction in 2008, 3D PLUS NOR Flash memory modules have set the standard for high-density, space-grade NOR Flash. Ideal for small-density Solid State Data Recorders and essential for processor boot and Program ROM in high-performance computer boards, these reliable memory solutions have powered groundbreaking missions like MSL, Insight, Mars 2020, and the EMM-Hope Probe. With a proven track record, 3D PLUS radiation-tolerant NOR Flash modules remain the go-to choice for critical space applications.

Key Features

  • Parallel access interface x 8 or x16

  • 20 years data retention

  • Small footprint

  • Radiation tolerance:

    TID > 20 krad (Si)

    SEL LETth > 51.2 MeV.cm²/mg

    SEU LETth > 10.0 MeV.cm²/mg;
    σsat = 1e-11 cm²/bit

  • Available in all 3D PLUS screening and qualification options:

    Commercial (C )

    Industrial (I)

    Space qualified (S)

  • Long life cycle products with proven reliability in Space

    No pure tin guarantee

    Large and worldwide flight heritage

Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The  screening level

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Density Part Number Description Package Temperature
64 Mb 3DFO64M16VS1281 4M x16
90 ns access time
SOP 54 -55 °C to +125 °C
128 Mb 3DFO128M16VS2282 8M x16
90 ns access time
SOP 54 -55 °C to +125 °C
256 Mb 3DFO256M16VS4105 16M x16
90 ns access time
SOP 54 -55 °C to +125 °C
3DFO256M16VS4269 16M x16
90 ns access time
SOP 54 -55 °C to +125 °C
512 Mb 3DFO512M16VS8492 32M x16
90 ns access time
SOP 56 -55 °C to +125 °C
2 Gb 3DFO2G16VS4214 128M x16
100 ns access time
SOP 60 -55 °C to +125 °C
3DFO2G08VS4215 256M x8
110 ns access time
SOP 60 -55 °C to +125 °C

Design Tools

Design Tools

64 Mb

Assembly Recommendations PDF - 805 ko Télécharger
Footprint PDF - 268 ko Télécharger

128 Mb

Asembly Recommendations PDF - 805 ko Télécharger
Footprint PDF - 271 ko Télécharger

256 Mb

Assembly Recommendations PDF - 805 ko Télécharger
Footprint PDF - 276 ko Télécharger

512 Mb

Assembly Recommendations PDF - 805 ko Télécharger
Footprint PDF - 271 ko Télécharger

2 Gb

Assembly Recommendations PDF - 805 ko Télécharger
Footprint PDF - 286 ko Télécharger

Documentation

Density Part Number Flyer
64 Mb 3DFO64M16VS1281 Flyer PDF - 86ko Télécharger
128 Mb 3DFO128M16VS2282 Flyer PDF - 86ko Télécharger
256 Mb 3DFO256M16VS4105 Flyer PDF - 88ko Télécharger
256 Mb 3DFO256M16VS4269 Flyer PDF - 87ko Télécharger
512 Mb 3DFO512M16VS8492 Flyer PDF - 99ko Télécharger
2 Gb 3DFO2G16VS4214 Flyer PDF - 891ko Télécharger
2 Gb 3DFO2G08VS4215 Flyer PDF - 87ko Télécharger