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3D PLUS a plus de 210 000 composants microélectroniques dans l’espace, et plus de 25 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
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Electrically Erasable and Programmable ROM (EEPROM) offer on-board and in-orbit programming capabilities as non-volatile memories essential for space applications. 3D PLUS Radiation Tolerant EEPROM stacks guarantee high endurance and exceptional data retention time. Available with 3.3 V or 5.0 V power supply, these memories support various data bus widths including x8b, x32b, and x40b. Encased in compact SOP packages, they are ideal for Surface Mount (SMT) assembly, providing high resistance to harsh thermal and mechanical environments.
Released in 2003, 3D PLUS Radiation Tolerant EEPROM products have been widely utilized as processors’ Boot and Program ROM in high-performance computer boards. They have excelled in a range of space applications, such as scientific deep space missions, Earth observation, launchers, manned space vehicles, and navigation satellites. These EEPROM modules have built a unique flight heritage with successful missions including Exomars 2016, Chang’e 5, H-IIA/H-IIB, Chandrayaan-3, and Orion Artemis.
While EEPROM has proven its reliability, it is no longer recommended for new designs. Instead, we suggest transitioning to Magnetoresistive Random-Access Memory (MRAM). MRAM offers high speed, unlimited read and write endurance, and non-volatile memory capabilities. Both EEPROM and MRAM memories are byte-addressed and operate with active LOW control signals, ensuring protocol compatibility. 3D PLUS MRAM memories also present excellent radiation tolerance, making them an ideal replacement for EEPROM in space applications.
High density – smallest footprint (more than 85 % area savings on board)
Wide data bus up to x40
Parallel access interface
10, 000 Write/Erase cycles capability
10 years data retention
Radiation Tolerance:
TID > 80 krad(Si) (Read) > 25 krad(Si) (Write)
SEL LETth > 80 MeV.cm²/mg
SEU LETth > 80 MeV.cm²/mg (Standby) >25 MeV.cm²/mg (Read); σsat = 1e-05 cm²/device >10 MeV.cm²/mg (Write); σsat = 5e-04 cm²/device
Space quality level and very large flight heritage worldwide
No pure tin guarantee (less than 97% tin guarantee)
Long life cycle products with proven reliability in Space
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information. Memory Part Number Decoder
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.
The youngest-ever moon samples returned to Earth It was the fifth lunar exploration mission of the Chinese Lunar Exploration Program, and China's first lunar sample-return mission.
