Space Camera Head CASPEX 4M

Overview

The CASPEX Space Camera Head family provides high resolution and high performance camera heads for space applications. Integrated using 3D PLUS packaging technology, each camera head embeds a high performance image sensor associated user-reconfigurable FPGA-based electronic architecture, allowing configurable embedded image processing and formatting for a versatile use.

The CASPEX 4M Space Camera Head embeds all necessary components to operate its 4Mpx CMOS image sensor and FPGA in a highly constrained space environment, including all DC-DC converters, Latch-up protection and processing and storage memories in a reduced volume of 35x35x23mm3. This camera module offers a configurable electrical interface through a 55-pins PGA matrix, including 12 LVDS pairs, 13 general purpose I/Os, a JTAG interface for FPGA configuration, and a 5V to 9V power supply interface. The 4Mpx Space Camera Head design provides to the users a dedicated optical, mechanical and thermal interface for an optimal and easy integration in space optical instruments.

The CASPEX 4M Space Camera head is a generic product, suitable for multiple space applications such as scientific imaging, platform and payload monitoring, startracking or navigation applications.

The CASPEX 4M Space Camera head Has been selected in the scope of multiple missions, including NASA’s Mars Sample Return program (SuperCam, MSR-ERO, MSR-STA), and benefits from flight heritage since 2019.

Key features

• 

  All-in-one space qualified camera head :

  • 2048×2048 Global Shutter Visible CMOS image sensor (monochrome/RGB)
  • Up to 16 frame/s in acquisition mode at sensor interface
  • Medium performances FPGA architecture with integrated memories
  • Read Noise : 13 e-, Dark current : 125 e-/s at 25°C
  • FWC : 13.5k e
  • Operating temperature range: -40 °C to +70 °C
• 

  High level of miniaturization and optimization :

  • Dimensions: 35 x 35 mm x 23mm³ for 64g
  • Optimized mechanical/thermal/optical interface
• 

  Enhanced radiation performances :

  • TID > 30 krad
  • SEL LET > 60 MeV.cm²/mg

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

• The product’s Part Number
• The temperature range
• The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Camera Part Number Decoder

Design Tools

CASPEX 4Mpx Evaluation kit

Camera evaluation kits are ready to use evaluation and prototyping environment compatible with 3D PLUS camera heads products, including hardware and software tools to support the use and integration of the camera heads. It allows configuration and operating of the camera heads in a test environment (instrument integration, optical bench, testing facilities).

Software options and IP Core

3D PLUS space camera heads family offers several options for the configuration of its cameras, all compliant with ECSS-QST-60-02C ESA development standard