A System-In-Package (SiP) consists of a number of dissimilar integrated circuits enclosed in a single highly miniaturized package. The SiP performs all or most of the functions of an electronic system, and, it can contain several silicon components (bare die or package) and passive components.

3D PLUS provides a one-stop source for customer’s concept analysis, feasibility study, design, manufacturing and test of high reliability and high performance SiP.

Our State-of-the-Art stacking technology for SiP allow us to bring the best standard semiconductor devices and technology node in one single highly miniaturized package with almost no limit for the merging of heterogeneous technologies (die – package – passives).

3D PLUS provides four different very flexible Stack Technology Flows that can be used for the design of various styles of SiPs:

  • Standard packages stack
  • Flex Process – bare die stack
  • Flex Process – SiP stack (heterogeneous components and mixed technology stacks)
  • Wafer Level Stack – WDoD™

Depending on the SiP performance requirements and targeted market, the relevant stacking process will be selected within 3D PLUS technology portfolio in order to bring the best added value and benefits for our customer designs.

Achieving a combination that cannot be realized with monolithic System-on-Chip (SoC) approaches, and, relying on a proven “first time right” design and development methodology, 3D PLUS SiP stacks are more effective and have also a lower development cost and a faster time to market.


    • Heterogeneous systems : ability to merge different die, package technologies (flip-chip, FBGA, SOT, SOP,….) and form factors
    • Improved reliability : space qualified stacking technology, fewer connectors and solder-joints, rugged to extremely harsh environments
    • Improved performance : improved speed and signal integrity (less parasitic elements)
    • Improved flexibility : modular design enables low-cost system changes, reduce PWB application routing complexity



    • Design secrecy : encapsulated 3D Stacks are hard to reverse-engineer
    • Improved time-to-market : Ability to achieve greater functionality in a time-to-market window than silicon integration cannot meet
    • Proven “first time right” design and development methodology
    • Recognized turn-key design, manufacturing and test
    • Flexible business model and supply chain management from multi-unit to mass manufacturing
    • Very small form factor and low profile (more than 80% reductions in size and weight + up-system and in service induced benefits)



Start your SiP design here

  • Initial Concept Analysis and Feasibility Study

    • Initial requirements analysis
    • Initial feasibility study and SiP technology selection
    • Manufacturing line selection
    • Initial module architecture and mechanical outline
    • Development cost and planning estimation
    • Recurring manufacturing and test cost estimation
  • KO

  • Requirement Detailed Analysis

    • Detailed requirements specification analysis
    • Final design trade-offs & feasibility studies
    • Product Requirement Specification
  • KO

  • Preliminary Design Study

    • Functional and physical partitioning analysis
    • Module physical architecture and layers’ definition
    • Electrical analysis (power dissipated, grounding allocation, critical signal paths, I/Os characteristics)
    • Thermal and mechanical analysis
    • Environmental compatibility analysis including space radiations (TID,SEL,SEU) if necessary
    • Preliminary Mechanical Outline
    • Design Validation Plan
    • Initial SiP’s Documentation
  • PDR

  • Detailed Design

    • Electrical design capture
    • Detailed design and lay-out of the SiP module
    • Detailed design and lay-out of each module’s layer
    • Electrical Analysis and simulation
    • Final thermal and mechanical analysis
    • Detailed design report
    • Detailed validation plan definition
    • Test equipment and procedure definition
    • Product qualification plan
  • DDR

  • Prototype Manufacturing and Test

    • Design and manufacturing of the manufacturing and test specific tools (HW & SW),
    • Parts and materials procurement
    • Manufacturing and test of prototypes on the relevant line (space qualified or industrial manufacturing line)
    • Prototypes
    • Validation test report
    • Qualification test report
    • Final updated Product specification and data sheet
  • CDR

  • Industrialization & Manufacturing Ramp-Up

    • Procurement of the additional manufacturing and test specific tools for mass/recurring manufacturing if necessary
    • Manufacturing and test ramp-up


Summarize the following information to submit your custom SiP concept analysis and feasibility study:

  • Part list (final or preliminary)
  • Block diagram (if available)
  • Main electrical features (voltages, currents, operating frequency, …)
  • Power dissipated
  • Module max size
  • Module Mounting technology
  • Module I/O number
  • Other characteristics (environment specification, quantity, quality grade,…)


Ordering information

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.

Computer, Power and SiP Products P/N Decoder