Overview: Radiation Tolerant DDR SDRAM Space Memory

3D PLUS offers a range of advanced DDR memory solutions designed specifically for challenging space environments. Ranging from 2 Gb to 8 Gb, these Radiation Tolerant DDR SDRAM stacks deliver high density and high-speed performance, capable of achieving speeds up to 400 MT/s. powered at 2.5 V, these memories come with a variety of data bus widths including x16b, x32b, and x72b, making them the highest density and fastest space-qualified DDR options on the market.

Available in compact SOP or BGA packages, these DDR1 modules are engineered for high resistance Surface Mount (SMT) assembly, ensuring they can withstand harsh thermal and mechanical conditions typical of space missions. First released in 2009, 3D PLUS’s SDRAM products have become a staple in high-performance computer boards, acting as fast processor RAM and providing high-density storage in Solid State Data Recorder boards.

Renowned for their reliability, 3D PLUS space memories have been deployed across a wide array od space applications, from scientific exploration to deep space missions. The radiation tolerant DDR SDRAM have been integral to missions such as Formosta-5, SWOT, Exomars 2022 among others. As the demand for Rad-hard and Radiation Tolerant memory solutions continues to grow, 3D PLUS remains at the forefront, offering unparalleled performance and durability for the most demanding space environments.

Key features

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  Highest density – smallest footprint (more than 85 % space savings in the design)

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  Wide data bus up to x72.

  High speed up to 400 MT/s

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  Radiation tolerance:

  TID > 50 krad(Si)

  SEL LET_th > 80 MeV.cm²/mg

  SEU LET_th : 0.7 MeV.cm²/mg ;
  σ_sat = 1E-9 cm²/bit

  SEFI LET_th : 0.7 MeV.cm²/mg ;
  σ_sat = 5.6E-4 cm²/device

• 

  Space quality level.

  No pure tin guarantee (less than 97% tin guarantee)

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  Very long life time electronics (technology proven for 15 to 18 years missions in space)

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  Worldwide delivery guarantee

STATUS

The DDR1 are not recommended for new design.

DDR SDRAM SPACE MEMORY Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

• The product’s Part Number
• The temperature range
• The screening level

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Design Tools

2 Gb

4 Gb

8 Gb