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3D PLUS a plus de 200 000 composants microélectroniques dans l’espace, et plus de 20 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
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From 512 Mb to 4 Gb, our Radiation Tolerant SDRAM space memory stacks enable high-density and high-speed data transfer solutions. The 3.3 V powered memories feature a wide range of data bus widths: x8b, x16b, x32b, x40b or x64b. They are offered in compact SOP, BGA or QFP package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.
First released in 2003, 3D PLUS SDRAM products are used as processor RAM in a variety of high performance computer boards, and as high density storage memory in Solid State Data Recorder boards. Their use in diverse fields of space applications such as science and deep space missions, Earth observation, launchers and manned space vehicles, navigation satellites, etc. , provides a unique flight heritage. 3D PLUS SDRAM memories have been used on missions such as MSL, Juno, Exomars 2016, Parker Solar Probe, Chandrayaan-3, and others.
Highest density – smallest footprint (more than 85 % space savings in the design)
High speed up to 133 MHz
Wide data bus up to x64
Radiation tolerance:
TID > 50 krad(Si)
SEL LETth > 80 MeV.cm²/mg
SEU LETth : 7 MeV.cm²/mg ; σsat = 2E-10 cm²/bit
Space quality level and very large flight heritage worldwide
No pure tin guarantee (less than 97% tin guarantee)
Very long life time electronics (technology proven for 15 to 18 years missions in space)
Worldwide delivery guarantee
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
SOP 62
Seek signs of past life and study rocks and soils composition