3D PLUS provides a minimum product longevity of 10 years which is consistent with many customers’ requirements. We are committed to product longevity for our customers and have strategies and internal policies in place to uphold this commitment.
3D PLUS has inventory and manufacturing strategies in place to allow us to offer products that exist for a decade or more. Our inventory management strategy enables us to anticipate market demand for catalog products.
3D PLUS products are not eligible for obsolescence if :
The product has had any sales within the last five years.
The product can be manufactured and has been in production for less than 10 years. The product has any current customer demand.
The obsolete products are communicated to customers thru PCN, PTN
PCN, PTN
After a product releases to market, 3D PLUS may need to modify, update or discontinue the product or manufacturing process.
The change or termination is notified thru PCN (Part Change Notification) or PTN (Part Termination Notification).
3D PLUS provides the following information before implementing any notifiable change:
- PCN number
- Type of change
- Detailed description
- Reason for change
- Product identification (affected products)
- Impact on fit, form, function, quality & reliability
- Coming into force
- Sample availability date
- Projected production shipment date
PCN,PNT DOCUMENTS
| PCN 051- Web Data Transfer Coming Into Force | PDF - 50 ko Télécharger |
| PCN 050- PoL 3DPM0289 | PDF - 52 ko Télécharger |
| PCN 048- RTIMS Flash V1 Obsolete | PDF - 420 ko Télécharger |
| PCN 047- New detail specification format (3DPA) | PDF - 176 ko Télécharger |
| PCN 045 - Epoxy resin change | PDF - 47 ko Télécharger |
| PCN 044 - Dimensions of 3DFN64G08VB1388, 64Gb NAND Flash x8 | PDF - 48 ko Télécharger |
| PCN 043 - 4Gb DDR3 512Mx8b | PDF - 454 ko Télécharger |
| PCN 042 - Format change for stack memory product Destructive Physical Analysis by 3D PLUS | PDF - 154 ko Télécharger |
| PCN 041-1 - 2.56Gb SDRAM – 64Mx40b | PDF - 1029 ko Télécharger |
| PCN 040 - EOL notification on the LGA memory component for 3DFN64G08VB1388 | PDF - 973 ko Télécharger |
| PCN 039 - Update of Standard Flight Code and related IPS for 3DCM734/3DCM739 Space Camera Head | PDF - 754 ko Télécharger |
| PCN 038 - Chamfers applied on some modules at each four top corners | PDF - 956 ko Télécharger |
| PCN 037 - Alternative material for the bottom substrate of 3D PLUS modules | PDF - 883 ko Télécharger |
| PCN 036 - Space grades EEPROM modules EOL | PDF - 502 ko Télécharger |
| PCN 035 - Component LAT quantity change for 3D PLUS standard Flow | PDF - 454 ko Télécharger |
| PCN 034 - 3DSS24G08VS3626 - RTIMS FLASH - Quality Grade availability change | PDF - 916 ko Télécharger |
| PCN 033 - EEPROM modules change of basic component for Non-space grades (IB-CN,SB, MB grades) | PDF - 895 ko Télécharger |
| PCN 032 - Serial Number Marking | PDF - 857 ko Télécharger |
| PCN 031 - 2Gb SDRAM x16b 3DSD2G16VS4654 EOL and replace by 3DSD2G16VS4767 | PDF - 452 ko Télécharger |
| PCN 029 - Hi-Rel N/B grade marking change | PDF - 145 ko Télécharger |
| PCN 028 - DDR3 8Gb 3D3D8G32YB1637 EOL and replacement | PDF - 17 ko Télécharger |
| PCN 027 - DDR3 4Gb marking update | PDF - 158 ko Télécharger |
| PCN 026 - DDR1 Modules EOL and Replacement | PDF - 152 ko Télécharger |
| PCN 025 - Nand Flash Modules Revision and EOL | PDF - 168 ko Télécharger |
| PCN 024 - Retinning material changes to Sn91.5Sb8.5 | PDF - 148 ko Télécharger |
| PCN 023 - PoL 3DPM0024-3 EoL and component replacement | PDF - 114 ko Télécharger |
| PCN 022 - Release of DDR2 TR v2 - component replacement | PDF - 114 ko Télécharger |
| PCN 020 - CCD Micro Camera Heads replacement | PDF - 97 ko Télécharger |
| PCN 018 - 1Gb DDR2 SDRAM Basic Device Replacement | PDF - 116 ko Télécharger |
| PCN 017 - High Rel Product Assembly Recommendation Update | PDF - 179 ko Télécharger |
| PCN 015 - 4Gb Nand Flash Basic Device Replacement | PDF - 120 ko Télécharger |
| PCN 014 - Module Options Marking Change | PDF - 240 ko Télécharger |
| PCN 013 - Tantalum Shielding Thickness Change | PDF - 117 ko Télécharger |
| PCN 012 - SDRAM Basic Device Replacement | PDF - 220 ko Télécharger |
| PCN 011 - SDRAM Product Family upgrade | PDF - 687 ko Télécharger |
| PCN 010 - Upgrade of NAND Flash Basic Device | PDF - 133 ko Télécharger |
| PCN 009 - Marking of Industrial Modules | PDF - 214 ko Télécharger |
| PCN 008 - New lead bending for the NAND and NOR Flash memory modules | PDF - 1178 ko Télécharger |
| PCN 007 - Modules’ Case connection to Ground (GND) | PDF - 155 ko Télécharger |
| PCN 005 - SRAMs 5V Basic Device Replacement Update | PDF - 1487 ko Télécharger |
| PCN 004 - SRAMs Basic Device Replacement Rev3 | PDF - 1710 ko Télécharger |
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