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Quality Assurance Cycle de vie du produit

3D PLUS provides a minimum product longevity of 10 years which is consistent with many customers’ requirements. We are committed to product longevity for our customers and have strategies and internal policies in place to uphold this commitment.

3D PLUS has inventory and manufacturing strategies in place to allow us to offer products that exist for a decade or more. Our inventory management strategy enables us to anticipate market demand for catalog products.

3D PLUS products are not eligible for obsolescence if :

The product has had any sales within the last five years.
The product can be manufactured and has been in production for less than 10 years. The product has any current customer demand.
The obsolete products are communicated to customers thru PCN, PTN

PCN, PTN

After a product releases to market,  3D PLUS may need to modify, update or discontinue the product or manufacturing process.

The change or termination is notified thru PCN (Part Change Notification) or PTN (Part Termination Notification).

3D PLUS provides the following information before implementing any notifiable change:

  • PCN number
  • Type of change
  • Detailed description
  • Reason for change
  • Product identification (affected products)
  • Impact on fit, form, function, quality & reliability
  • Coming into force
  • Sample availability date
  • Projected production shipment date

PCN,PNT DOCUMENTS

 

PCN 047- New detail specification format (3DPA) PDF - 176 ko Télécharger
PCN 045 - Epoxy resin change PDF - 47 ko Télécharger
PCN 044 - Dimensions of 3DFN64G08VB1388, 64Gb NAND Flash x8 PDF - 48 ko Télécharger
PCN 043 - 4Gb DDR3 512Mx8b PDF - 454 ko Télécharger
PCN 042 - Format change for stack memory product Destructive Physical Analysis by 3D PLUS PDF - 154 ko Télécharger
PCN 041-1 - 2.56Gb SDRAM – 64Mx40b PDF - 1029 ko Télécharger
PCN 040 - EOL notification on the LGA memory component for 3DFN64G08VB1388 PDF - 973 ko Télécharger
PCN 039 - Update of Standard Flight Code and related IPS for 3DCM734/3DCM739 Space Camera Head PDF - 754 ko Télécharger
PCN 038 - Chamfers applied on some modules at each four top corners PDF - 956 ko Télécharger
PCN 037 - Alternative material for the bottom substrate of 3D PLUS modules PDF - 883 ko Télécharger
PCN 036 - Space grades EEPROM modules EOL PDF - 502 ko Télécharger
PCN 035 - Component LAT quantity change for 3D PLUS standard Flow PDF - 454 ko Télécharger
PCN 034 - 3DSS24G08VS3626 - RTIMS FLASH - Quality Grade availability change PDF - 916 ko Télécharger
PCN 033 - EEPROM modules change of basic component for Non-space grades (IB-CN,SB, MB grades) PDF - 895 ko Télécharger
PCN 032 - Serial Number Marking PDF - 857 ko Télécharger
PCN 031 - 2Gb SDRAM x16b 3DSD2G16VS4654 EOL and replace by 3DSD2G16VS4767 PDF - 452 ko Télécharger
PCN 029 - Hi-Rel N/B grade marking change PDF - 145 ko Télécharger
PCN 028 - DDR3 8Gb 3D3D8G32YB1637 EOL and replacement PDF - 17 ko Télécharger
PCN 027 - DDR3 4Gb marking update PDF - 158 ko Télécharger
PCN 026 - DDR1 Modules EOL and Replacement PDF - 152 ko Télécharger
PCN 025 - Nand Flash Modules Revision and EOL PDF - 168 ko Télécharger
PCN 024 - Retinning material changes to Sn91.5Sb8.5 PDF - 148 ko Télécharger
PCN 023 - PoL 3DPM0024-3 EoL and component replacement PDF - 114 ko Télécharger
PCN 022 - Release of DDR2 TR v2 - component replacement PDF - 114 ko Télécharger
PCN 020 - CCD Micro Camera Heads replacement PDF - 97 ko Télécharger
PCN 018 - 1Gb DDR2 SDRAM Basic Device Replacement PDF - 116 ko Télécharger
PCN 017 - High Rel Product Assembly Recommendation Update PDF - 179 ko Télécharger
PCN 015 - 4Gb Nand Flash Basic Device Replacement PDF - 120 ko Télécharger
PCN 014 - Module Options Marking Change PDF - 240 ko Télécharger
PCN 013 - Tantalum Shielding Thickness Change PDF - 117 ko Télécharger
PCN 012 - SDRAM Basic Device Replacement PDF - 220 ko Télécharger
PCN 011 - SDRAM Product Family upgrade PDF - 687 ko Télécharger
PCN 010 - Upgrade of NAND Flash Basic Device PDF - 133 ko Télécharger
PCN 009 - Marking of Industrial Modules PDF - 214 ko Télécharger
PCN 008 - New lead bending for the NAND and NOR Flash memory modules PDF - 1178 ko Télécharger
PCN 007 - Modules’ Case connection to Ground (GND) PDF - 155 ko Télécharger
PCN 005 - SRAMs 5V Basic Device Replacement Update PDF - 1487 ko Télécharger
PCN 004 - SRAMs Basic Device Replacement Rev3 PDF - 1710 ko Télécharger
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Plus d'informations sur notre entreprise

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