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3D PLUS a plus de 210 000 composants microélectroniques dans l’espace, et plus de 25 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
Demande d'information
MNEMOSYNE aka the memory goddess is a non volatile memory ASIC derived from a project with the same name. The MNEMOSYNE project funded by EU’s program H2020 and launched in 2019 aimed to develop a non volatile memory ASIC with serial interface designed space constraints, with guaranteed supply chain (entirely manufactured in Europe). The memory ASIC designed was cross validated by a consortium of radiation effects and space electronics experts. More details on the EU project follow the link here
MNEMOSYNE space grade modules are stacks of SEE (latch-up, upset, SEFI, transient) immune ASICs designed with the 22 nm STT-MRAM FDSOI process. Our radiation tolerant modules feature high density, high endurance, long time data retention and serial or parallel interface. The modules are offered in SOP or BGA package for high resistance Surface Mount (SMT) assembly and for withstanding harsh thermal and mechanical environments.
MNEMOSYNE products are the best in class regarding reliability and density. They are perfectly suited for being used as configuration solution for the latest SRAM-based FPGAs or as boot/program code storage for leading processors.
Interfaces (only one at time):
Serial
Parallel
Modes supported:
SPI, DSPI, QSPI, OSPI for serial interface
EEPROM for parallel interface
Voltage supply:
1.8 V
1.8 V & 3.3 V
Radiation Performances:
TID > 100 krad(Si)
SEL LETth > 85 MeV.cm²/mg @ 125 °C
SEU LETth > 85 MeV.cm²/mg
SEFI LETth > 85 MeV.cm²/mg
SET LETth > 85 MeV.cm²/mg
Operating temperature: -55°C to +125°C
Endurace: 100, 000 P/E cycles
Data retention: 20 years
Embedded ECC
Worldwide Delivery Guaranty
Space grade high density configuration memory – Up to 1 Gb of SEE Immune Storage
Best in class regarding reliability (data retention, P/E cycles, radiation)
Data reliability guaranteed, no need for external ECC.
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
1.8 V SPI interface
3.3 V SPI interface
512 Mb 3.3V SPI
1 Gb 3.3V SPI