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3D PLUS provides compact DDR4 modules including termination resistors and decoupling capacitors for applications requiring high-speed computing memory.
Thanks to 3D PLUS proven stacking technology, DDR4 ruggedized modules offer high reliability in BGA packages for harsh environments.

Key features

  • Density up to 128 Gbit

  • Bus width: 72 bits

  • Data transfer: 2400 Mbps

  • Decoupling capacitors and Termination resistors included

  • Available in Industrial and Military temperature range

  • Long term supply continuity

Line up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.

Memory Part Number Decoder


Part Number Density Configuration Voltage Clock rate Package Temperature Balls
3D4D32G72LB2758 32Gbit 512Mbit x 64 + 8 b ECC 1.2 V 1200 MHz BGA 267 I, S, M SnPb
3D4D64G72LB2809 64Gbit 1024 Mbit x 64 + 8 b ECC 1.2 V 1200 MHz BGA 267 I, S, M SnPb
3D4D128G72LB2844 128Gbit 2048 Mbit x 64 + 8 b ECC 1.2 V 1200 MHz BGA 267 I, S, M SnPb



Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.

P/N Density Datasheet
3D4D32G72LB2758 32Gbit Datasheet PDF - 2712ko Télécharger
3D4D64G72LB2809 64Gbit Datasheet PDF - 1990ko Télécharger
3D4D128G72LB2844 128Gbit Datasheet