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3D PLUS a plus de 210 000 composants microélectroniques dans l’espace, et plus de 25 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
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The compact and flexible DDR2, DDR3, and DDR4 Termination Regulator (TR) modules are perfect for low input voltage and low-noise Double Data Rate (DDR) memories. These Termination Regulator modules offer fast transient response times, a remote sensing function, and can be controlled via the Command pin. Additionally, they provide all the power requirements for DDR VTT bus designs.
By incorporating radiation effect mitigation techniques, the Termination Regulator modules become the ultimate solution for use with DDR memories in high reliability space applications. Manufactured with 3D PLUS’s Space qualified stacking technology, these modules are specifically designed for high reliability applications. They are available in a compact and lightweight package, making them suitable for various environments.
Experience the benefits of these Rad-Hard-by-Design TR modules with your DDR memories. Improve the performance and reliability of your DDR VTT bus designs with our 3D PLUS expertise. Trust us for high-quality modules that surpass your expectations in high-reliability applications. Don’t miss out on the opportunity to optimize your DDR VTT bus designs with our state-of-the-art Termination Regulator modules.
Tightly regulated voltage on VTToutput (JEDEC compatible)
Eliminates the need for external output capacitors
Source and Sink current capability of ±1A (DDR2 TR) or ±2A (DDR3 TR and DDR4 TR)
Radiation Hardened design:
TID > 50 krad(Si) for DDR2 TR and TID > 100 krad(Si) for DDR3 TR and DDR4 TR
SEL and SET > 62.5 MeV.cm²/mg
Operating temperature -40°C / +105°C
Compact footprint with
24-SOP (DDR2 TR)
127-BGA (DDR2 TR)
259-BGA package (DDR3 TR and DDR4 TR)
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Computer, Power and SiP Part Number Decoder
Other technical documentation is available under request: Application Notes, IBIS, RTL, Step and Mechanical file, Radiation Report.
