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Overview

Electrically Erasable and Programmable ROM (EEPROM) enable on-board and in-orbit programming capability as non volatile memories. Based on the very rugged NMOS memory cell technology, our Radiation Tolerant EEPROM stacks feature high endurance and high data retention time. The 3.3 V or 5.0 V powered memories feature a wide range of data bus widths: x8b, x32b or x40b. They are offered in compact SOP package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.

Released in 2003, 3D PLUS EEPROM products are used as processor’s Boot and Program ROM in a variety of high performance computer boards. Their use in diverse fields of space applications such as science and deep space missions, Earth observation, launchers and manned space vehicles, navigation satellites, etc. , provides a unique flight heritage. These memory modules have been used on missions such as  Exomars 2016, Change’5, H-IIA/H-IIB, Chandrayaan-3, Orion Artemis, and others.

Status

EEPROM  is not recommended for new design, instead we recommend MRAM which is a high speed, unlimited read and write endurance and  non- volatile random access memory. EEPROM and MRAM memories are both byte-addressed, with active LOW control signals. It means that both protocols are basically compatible. Our MRAM memories present excellent radiation performances , thus they are suitable to replace our EEPROM memories.

Key Features

  • High density – smallest footprint (more than 85 % area savings on board)

  • Wide data bus up to x40

    Parallel access interface

  • 10, 000 Write/Erase cycles capability

    10 years data retention

  • Radiation Tolerance:

    TID
    > 80 krad(Si) (Read)
    > 25 krad(Si) (Write)

    SEL LETth > 80 MeV.cm²/mg

    SEU LETth
    > 80 MeV.cm²/mg (Standby)
    >25 MeV.cm²/mg (Read);
    σsat = 1e-05 cm²/device
    >10 MeV.cm²/mg (Write);
    σsat = 5e-04 cm²/device

  • Space quality level and very large flight heritage worldwide

    No pure tin guarantee (less than 97% tin guarantee)

  • Long life cycle products with proven reliability in Space

Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Density Part Number Description Package Temperature
1 Mb 3DEE1M08VS1192 128K x8
250 ns access time
SOP 40 -55 °C to +125 °C
2 Mb 3DEE2M08VS2154 256K x16
250 ns access time
SOP 40 -55 °C to +125 °C
4 Mb 3DEE4M08VS4145 512K x8
250 ns access time
SOP 40 -55 °C to +125 °C
3DEE4M32VS4162 128K x8
250 ns access time
SOP 40 -55 °C to +125 °C
5 Mb 3DEE5M40VS5257 128K x40
250 ns access time
SOP 40 -55 °C to +125 °C
8 Mb 3DEE8M08VS8190 1M x8
250 ns access time
SOP 40 -55 °C to +125 °C
3DEE8M32VS8094 256K x32
250 ns access time
SOP 60 -55 °C to +125 °C

Design Tools

Design Tools

1 Mb

3DEE1M08VS1192- Assembly Recommendations PDF - 805 ko Télécharger
3DEE1M08VS1192- Footprint PDF - 237 ko Télécharger

2 Mb

3DEE2M08VS2154 - Asembly Recommendations PDF - 805 ko Télécharger
3DEE2M08VS2154 - Footprint PDF - 262 ko Télécharger

4 Mb

3DEE4M08VS4145 - Assembly Recommendations PDF - 805 ko Télécharger
3DEE4M08VS4145 - Footprint PDF - 276 ko Télécharger
3DEE4M32VS4162 - Assembly Recommendations PDF - 805 ko Télécharger
3DEE4M32VS4162 - Footprint PDF - 278 ko Télécharger

5 Mb

3DEE5M40VS5257 - Assembly Recommendations PDF - 805 ko Télécharger
3DEE5M40VS5257 - Footprint PDF - 273 ko Télécharger

8 Mb

3DEE8M08VS8190 - Assembly Recommendations PDF - 805 ko Télécharger
3DEE8M08VS8190 - Footprint PDF - 256 ko Télécharger

8 Mb

3DEE8M32VS8094 - Assembly Recommendations PDF - 805 ko Télécharger
3DEE8M32VS8094 - Footprint PDF - 271 ko Télécharger

Documentation

Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.

Density Part Number Flyer
1 Mb 3DEE1M08VS1192 Flyer PDF - 842ko Télécharger
2 Mb 3DEE2M08VS2154 Flyer PDF - 882ko Télécharger
4 Mb 3DEE4M08VS4145 Flyer PDF - 862ko Télécharger
4 Mb 3DEE4M32VS4162 Flyer PDF - 918ko Télécharger
5 Mb 3DEE5M40VS5257 Flyer PDF - 947ko Télécharger
8 Mb 3DEE8M08VS8190 Flyer PDF - 880ko Télécharger
8 Mb 3DEE8M32VS8094 Flyer PDF - 966ko Télécharger