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Overview: Radiation Tolerant EEPROM for Space Applications

Electrically Erasable and Programmable ROM (EEPROM) offer on-board and in-orbit programming capabilities as non-volatile memories essential for space applications. 3D PLUS Radiation Tolerant EEPROM stacks guarantee high endurance and exceptional data retention time. Available with 3.3 V or 5.0 V power supply, these memories support various data bus widths including x8b, x32b, and x40b. Encased in compact SOP packages, they are ideal for Surface Mount (SMT) assembly, providing high resistance to harsh thermal and mechanical environments.

Released in 2003, 3D PLUS Radiation Tolerant EEPROM products  have been widely utilized as processors’ Boot and Program ROM in high-performance computer boards. They have excelled in a range of space applications, such as scientific deep space missions, Earth observation, launchers, manned space vehicles, and navigation satellites. These EEPROM modules have built a unique flight heritage with successful missions including Exomars 2016, Chang’e 5, H-IIA/H-IIB, Chandrayaan-3, and Orion Artemis.

Status

While EEPROM has proven its reliability, it is no longer recommended for new designs. Instead, we suggest transitioning to Magnetoresistive Random-Access Memory (MRAM). MRAM offers high speed, unlimited read and write endurance, and non-volatile memory capabilities. Both EEPROM and MRAM memories are byte-addressed and operate with active LOW control signals, ensuring protocol compatibility. 3D PLUS MRAM memories also present excellent radiation tolerance, making them an ideal replacement for EEPROM in space applications.

Key Features

  • High density – smallest footprint (more than 85 % area savings on board)

  • Wide data bus up to x40

    Parallel access interface

  • 10, 000 Write/Erase cycles capability

    10 years data retention

  • Radiation Tolerance:

    TID
    > 80 krad(Si) (Read)
    > 25 krad(Si) (Write)

    SEL LETth > 80 MeV.cm²/mg

    SEU LETth
    > 80 MeV.cm²/mg (Standby)
    >25 MeV.cm²/mg (Read);
    σsat = 1e-05 cm²/device
    >10 MeV.cm²/mg (Write);
    σsat = 5e-04 cm²/device

     

  • Space quality level and very large flight heritage worldwide

    No pure tin guarantee (less than 97% tin guarantee)

  • Long life cycle products with proven reliability in Space

Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The  screening level

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Density Part Number Description Package Temperature
1 Mb 3DEE1M08VS1192 128K x8
250 ns access time
SOP 40 -55 °C to +125 °C
2 Mb 3DEE2M08VS2154 256K x16
250 ns access time
SOP 40 -55 °C to +125 °C
4 Mb 3DEE4M08VS4145 512K x8
250 ns access time
SOP 40 -55 °C to +125 °C
3DEE4M32VS4162 128K x8
250 ns access time
SOP 40 -55 °C to +125 °C
5 Mb 3DEE5M40VS5257 128K x40
250 ns access time
SOP 40 -55 °C to +125 °C
8 Mb 3DEE8M08VS8190 1M x8
250 ns access time
SOP 40 -55 °C to +125 °C
3DEE8M32VS8094 256K x32
250 ns access time
SOP 60 -55 °C to +125 °C

Design Tools

Design Tools

1 Mb

3DEE1M08VS1192- Assembly Recommendations PDF - 805 ko Download
3DEE1M08VS1192- Footprint PDF - 237 ko Download

2 Mb

3DEE2M08VS2154 - Asembly Recommendations PDF - 805 ko Download
3DEE2M08VS2154 - Footprint PDF - 262 ko Download

4 Mb

3DEE4M08VS4145 - Assembly Recommendations PDF - 805 ko Download
3DEE4M08VS4145 - Footprint PDF - 276 ko Download
3DEE4M32VS4162 - Assembly Recommendations PDF - 805 ko Download
3DEE4M32VS4162 - Footprint PDF - 278 ko Download

5 Mb

3DEE5M40VS5257 - Assembly Recommendations PDF - 805 ko Download
3DEE5M40VS5257 - Footprint PDF - 273 ko Download

8 Mb

3DEE8M08VS8190 - Assembly Recommendations PDF - 805 ko Download
3DEE8M08VS8190 - Footprint PDF - 256 ko Download

8 Mb

3DEE8M32VS8094 - Assembly Recommendations PDF - 805 ko Download
3DEE8M32VS8094 - Footprint PDF - 271 ko Download

Documentation

Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.

Density Part Number Flyer
1 Mb 3DEE1M08VS1192 Flyer PDF - 842ko Download
2 Mb 3DEE2M08VS2154 Flyer PDF - 882ko Download
4 Mb 3DEE4M08VS4145 Flyer PDF - 862ko Download
4 Mb 3DEE4M32VS4162 Flyer PDF - 918ko Download
5 Mb 3DEE5M40VS5257 Flyer PDF - 947ko Download
8 Mb 3DEE8M08VS8190 Flyer PDF - 880ko Download
8 Mb 3DEE8M32VS8094 Flyer PDF - 966ko Download