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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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3D PLUS offers a range of high-performance, Radiation Tolerant SDRAM space memory solutions tailored to meet the demanding requirements of space applications. Available in capacities from 512 Mb to 4 Gb, our SDRAM memory stacks enable high-density and high-speed data transfer, essential for the rigorous demands of space missions. These 3.3 V powered memories come with versatile data bus widths, including x8b, x16b, x32b, x40b, and x64b, making them adaptable to various system architectures.
Our Radiation Tolerant SDRAMs are engineered to withstand harsh thermal and mechanical environments, ensuring reliable performance in space. They are packaged in space-optimized SOP, BGA, or QFP forms, designed for high resistance Surface Mount (SMT) assembly.
Since their first release in 2003, 3D PLUS SDRAM products have been trusted as processor RAM in high-performance computer boards and as high-density storage memory in Solid State Data Recorder boards. These memories have a proven track record in a diverse array of space applications, including scientific and deep space missions, Earth observation, launchers, manned space vehicles, and navigation satellites. This extensive flight heritage underscores their reliability and performance.
3D PLUS SDRAM memories have been integral to numerous high-profile missions such as MSL, Juno, Exomars 2016, Parker Solar Probe, and Chandrayaan-3. Their robust design and radiation tolerance make them the preferred choice for mission-critical space applications, ensuring data integrity and system reliability in the most challenging environments.
Highest density – smallest footprint (more than 85 % space savings in the design)
High speed up to 133 MHz
Wide data bus up to x64
Radiation tolerance:
TID > 50 krad(Si)
SEL LETth > 80 MeV.cm²/mg
SEU LETth : 7 MeV.cm²/mg ; σsat = 2E-10 cm²/bit
Space quality level and very large flight heritage worldwide
No pure tin guarantee (less than 97% tin guarantee)
Very long life time electronics (technology proven for 15 to 18 years missions in space)
Worldwide delivery guarantee
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
SOP 62
Seek signs of past life and study rocks and soils composition
