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Overview

Magneto Resistive Random Access Memory (MRAM) stores data using magnetic polarization rather than electric charge. Thus, it is an intrinsic radiation hardened non volatile memory that is immune to Single Event Upset (SEU) with SRAM speed performances. Based on Everspin technology, our 3.3 V MRAM stacks feature unlimited endurance, high data retention time and a wide range of data bus widths: x8b, x16b, x32b or x40b. They are offered in SOP package for high resistance Surface Mount (SMT) assembly and for withstanding harsh thermal and mechanical environments.

First released in 2007, 3D PLUS MRAM products are used as processor boot, program ROM and FPGA bitstream storage memory. They have been used in a variety of missions such as: Glonass, Sentinel 2, KompSat-6, and others

Key features

  • Highest density with smallest footprint ( more than 85% area savings on board)

    Unlimited read/write endurance

    20 years data retention

    Small footprint

  • Radiation tolerance:

    TID > 50krad (Si)

    SEL LETth > 85 MeV.cm²/mg

    SEU LETth
    > 85 MeV.cm²/mg (standby)
    10 MeV.cm²/mg  (dynamic);
    σsat = 2E-5 cm²/bit

     

  • No pure tin guarantee

    Long life cycle products with proven reliability in Space

    Large and worldwide flight heritage

Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Density Part Number Description Package Temperature
1 Mb 3DMR1M08VS1426 128K x8
40 ns access time
SOP 44 -55 °C to +105 °C
2 Mb 3DMR2M16VS2427 128K x16
40 ns access time
SOP 54 -55 °C to +105 °C
4 Mb 3DMR4M08VS4428 512K x8
40 ns access time
SOP 44 -55 °C to +105 °C
8 Mb 3DMR8M08VS8666 1M x8
40 ns access time
SOP 44 -55 °C to +105 °C
3DMR8M32VS8420 256K x32
40 ns access time
SOP 68 -55 °C to +105 °C
10 Mb 3DMR10M40VS5688 256K x40
40 ns access time
SOP 96 -55 °C to +105 °C
64 Mb 3DMR64M08VS4476 8M x8
40 ns access time
SOP 54 -55 °C to +105 °C

Design Tools

Design Tools

1 Mb

3DMR1M08VS1426 - Assembly Recommendations PDF - 805 ko Télécharger
3DMR1M08VS1426 - Footprint PDF - 266 ko Télécharger

2 Mb

3DMR2M16VS2427 - Assembly Recommendations PDF - 805 ko Télécharger
3DMR2M16VS2427 - Footprint PDF - 275 ko Télécharger

4 Mb

3DMR4M08VS4428 - Assembly Recommendations PDF - 805 ko Télécharger
3DMR4M08VS4428 - Footprint PDF - 254 ko Télécharger

8 Mb

3DMR8M08VS8666 - Assembly Recommendations PDF - 805 ko Télécharger
3DMR8M08VS8666 - Footprint PDF - 254 ko Télécharger
3DMR8M32VS8420 - Assembly Recommendations PDF - 805 ko Télécharger
3DMR8M32VS8420 - Footprint PDF - 311 ko Télécharger

10 Mb

3DMR10M40VS5688 - Assembly Recommendations PDF - 805 ko Télécharger
3DMR10M40VS5688 - Footprint PDF - 262 ko Télécharger

64 Mb

3DMR64M08VS4476 - Assembly Recommendations PDF - 805 ko Télécharger
3DMR64M08VS4476- Footprint PDF - 280 ko Télécharger

Documentation

Density Part Number Flyer
1 Mb 3DMR1M08VS1426 Flyer PDF - 1094ko Télécharger
2 Mb 3DMR2M16VS2427 Flyer PDF - 868ko Télécharger
4 Mb 3DMR4M08VS4428 Flyer PDF - 1045ko Télécharger
8 Mb 3DMR8M08VS8666 Flyer PDF - 1054ko Télécharger
8 Mb 3DMR8M32VS8420 Flyer PDF - 911ko Télécharger
10 Mb 3DMR10M40VS5688 Flyer PDF - 1052ko Télécharger
64 Mb 3DMR64M08VS4476 Flyer PDF - 1042ko Télécharger