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Overview

DDR2 SDRAM is an improved DDR Memory with higher speed and lower power consumption than DDR SDRAM. From 1 Gb to 8 Gb, our Radiation Tolerant DDR2 SDRAM modules are organized as x8b, x48b or x72b and with a 1.8 V power supply. Our DDR2 modules embed decoupling capacitors for excellent signal integrity and additional real estate savings on the users’ PCBs. They are offered in SOP or BGA package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.

First released in 2012, our DDR2 SDRAM products are used as fast processor’s RAM in a variety of high performance computer boards. They operate synergistically in an Ecosystem with two additional elements, providing  all-in-one, fully space qualified and radiation immune DDR2 memory solution. The DDR2 memory companion chips are:

  • The Radiation Intelligent Memory Controller (RIMC) for DDR2 (3DIPMC0700) is a fully configurable DDR2 SDRAM memory controller designed to work with 3D PLUS DDR2 modules to provide an overall radiation hardened memory solution. This IP core offers Single Event Upset (SEU) mitigation and Single Event Functional Interrupt (SEFI) protection to DDR2 operating in radiation-hazard environments.
  • A radiation hardened by design Termination Regulator DDR2 TR (3DPM0237). It provides enhanced termination and impedance adaptation, dramatically improving signal integrity.

Our DDR2 have been use in diverse missions such as: Mars 2020, and others.

Key features

  • Highest density – smallest footprint (more than 85 % space savings in the design)

  • Decoupling capacitors and termination resistors embedded

  • High speed up to 667 MT/s

  • Radiation tolerance (stand alone):

    TID > 100 krad(Si)

    SEL LETth > 68 MeV.cm²/mg

    SEU LETth : 2.4 MeV.cm²/mg ;
    σsat = 5.6E-11 cm²/bit

    SEFI LETth > 4.8 MeV.cm²/mg ;
    σsat = 4.5E-5 cm²/device

  • Radiation tolerance (w. RIMC DDR2):

    TID > 100 krad (Si)

    SEL LETth > 68 MeV.cm²/mg

    SEU/SERE/SECE/SEFI mitigation with 3DIPMC0700

  • Space quality level

    No pure tin guarantee (less than 97% tin guarantee)

    Very long life time electronics (technology proven for 15 to 18 years missions in space)

    Worldwide delivery guarantee

Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Density Part Number Description Package Temperature
1 Gb 3D2D1G08US1285 128M x8
667 MT/s
SOP 74 -40 °C to +105 °C
2 Gb 3D2D2G08US2662 256M x8
533 MT/s
SOP 74 -40 °C to +105 °C
3D2D2G16UB2684 128M x16
667 MT/s
BGA 295 -40 °C to +105 °C
4 Gb 3D2D4G08US4661 512M x8
533 MT/s
SOP 74 -40 °C to +105 °C
3D2D4G72UB3652 64M x72
667 MT/s
BGA 191 -40 °C to +105 °C
6 Gb 3D2D6G48UB3687 128M x48
667 MT/s
BGA 143 -40 °C to +105 °C
3D2D6G48UQ3694 128M x48
533 MT/s
QPF 144 -40 °C to +105 °C
8 Gb 3D2D8G08US8663 1G x8
533 MT/s
SOP 88 -40 °C to +105 °C

 

Design Tools

Design Tools

1 Gb

3D2D1G08US1285 - Assembly Recommendations PDF - 805 ko Télécharger
3D2D1G08US1285 - Footprint PDF - 289 ko Télécharger

2 Gb

3D2D2G08US2662 - Assembly Recommendations PDF - 805 ko Télécharger
3D2D2G08US2662 - Footprint PDF - 271 ko Télécharger
3D2D2G16UB2684 - Assembly Recommendations PDF - 1452 ko Télécharger
3D2D2G16UB2684 - Footprint PDF - 346 ko Télécharger

4 Gb

3D2D4G08US4661 - Assembly Recommendations PDF - 805 ko Télécharger
3D2D4G08US4661 - Footprint PDF - 284 ko Télécharger
3D2D4G72UB3652 - Assembly Recommendations PDF - 1452 ko Télécharger
3D2D4G72UB3652 - Footprint PDF - 369 ko Télécharger

6 Gb

3D2D6G48UB3687 - Assembly Recommendations PDF - 1452 ko Télécharger
3D2D6G48UB3687 - Footprint PDF - 352 ko Télécharger
3D2D6G48UQ3694 - Assembly Recommendations PDF - 805 ko Télécharger
3D2D6G48UQ3694 - Footprint PDF - 325 ko Télécharger

8 Gb

3D2D8G08US8663 - Assembly Recommendations PDF - 805 ko Télécharger
3D2D8G08US8663 - Footprint PDF - 302 ko Télécharger

Documentation

Density Part Number Flyer Decoupling Capacitator Unused pins
1 Gb 3D2D1G08US1285 Flyer PDF - 1092ko Télécharger Decoupling Capacitator Unused pins PDF - 184ko Télécharger
2 Gb 3D2D2G08US2662 Flyer PDF - 1102ko Télécharger Decoupling Capacitator PDF - 289ko Télécharger Unused pins PDF - 184ko Télécharger
2 Gb 3D2D2G16UB2684 Flyer PDF - 1076ko Télécharger Decoupling Capacitator PDF - 204ko Télécharger Unused pins PDF - 184ko Télécharger
4 Gb 3D2D4G08US4661 Flyer PDF - 1110ko Télécharger Decoupling Capacitator PDF - 340ko Télécharger Unused pins PDF - 184ko Télécharger
4 Gb 3D2D4G72UB3652 Flyer PDF - 951ko Télécharger Decoupling Capacitator PDF - 1044ko Télécharger Unused pins PDF - 184ko Télécharger
6 Gb 3D2D6G48UB3687 Flyer PDF - 1132ko Télécharger Decoupling Capacitator PDF - 431ko Télécharger Unused pins PDF - 184ko Télécharger
6 Gb 3D2D6G48UQ3694 Flyer PDF - 1034ko Télécharger Decoupling Capacitator PDF - 431ko Télécharger Unused pins PDF - 184ko Télécharger
8 Gb 3D2D8G08US8663 Flyer PDF - 1063ko Télécharger Decoupling Capacitator Unused pins PDF - 184ko Télécharger