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Overview

From 2 Gb to 8 Gb, our Radiation Tolerant DDR SDRAM stacks enable high-density and high-speed (up to 400 MT/s). Powered by 2.5 V, the memories feature a wide range of data bus widths: x16b, x32b or x72b, making them the highest density density and fastest space qualified DDR1 on space market. They are offered in compact SOP or BGA package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.

First released in 2009, 3D PLUS SDRAM products are used as fast processor RAM in a variety of high performance computer boards, and as high density storage memory in Solid State Data Recorder boards. They are used in diverse fields of space applications such as science and deep space missions, etc. These memory modules have been used on missions such as Formosat-5, SWOT, Exomars 2022, and others.

Key features

  • Highest density – smallest footprint (more than 85 % space savings in the design)

  • Wide data bus up to x72.

    High speed up to 400 MT/s

  • Radiation tolerance:

    TID > 50 krad(Si)

    SEL LETth > 80 MeV.cm²/mg

    SEU LETth : 0.7 MeV.cm²/mg ;
    σsat = 1E-9 cm²/bit

    SEFI LETth : 0.7 MeV.cm²/mg ;
    σsat = 5.6E-4 cm²/device

  • Space quality level.

    No pure tin guarantee (less than 97% tin guarantee)

  • Very long life time electronics (technology proven for 15 to 18 years missions in space)

  • Worldwide delivery guarantee

STATUS

Our DDR1 are not recommended for new design.

Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Density Part Number Description Package Temperature
2 Gb 3D1D2G16TS2174 128M x16
400 MT/s
SOP 66 -40 °C to +105 °C
3D1D2G32TS2491 64M x32
400 MT/s
SOP 86 -40 °C to +105 °C
4 Gb 3D1D4G72TB2729 64M x72
400 MT/s
BGA 239 -40 °C to +105 °C
8 Gb 3D1D8G16TS8466 512M x16
400 MT/s
SOP 78 -40 °C to +105 °C

 

Design Tools

Design Tools

2 Gb

3D1D2G16TS2174 - Assembly Recommendations PDF - 805 ko Télécharger
3D1D2G16TS2174 - Footprint PDF - 280 ko Télécharger
3D1D2G32TS2491 - Assembly Recommendations PDF - 805 ko Télécharger
3D1D2G32TS2491 - Footprint PDF - 297 ko Télécharger

4 Gb

3D1D4G72TB2729 - Assembly Recommendations PDF - 805 ko Télécharger
3D1D4G72TB2729 - Footprint PDF - 392 ko Télécharger

8 Gb

3D1D8G16TS8466 - Assembly Recommendations PDF - 805 ko Télécharger
3D1D8G16TS8466 - Footprint PDF - 284 ko Télécharger

Documentation

Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.

Density Part Number Flyer
2 Gb 3D1D2G16TS2174 Flyer PDF - 86ko Télécharger
2 Gb 3D1D2G32TS2491 Flyer PDF - 78ko Télécharger
4 Gb 3D1D4G72TB2729 Flyer PDF - 165ko Télécharger
8 Gb 3D1D8G16TS8466 Flyer PDF - 82ko Télécharger