3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
A System-In-Package (SiP) consists of a number of dissimilar integrated circuits enclosed in a single highly miniaturized package. The SiP performs all or most of the functions of an electronic system, and, it can contain several silicon components (bare die or package) and passive components.
3D PLUS provides a one-stop source for customer’s concept analysis, feasibility study, design, manufacturing and test of high reliability and high performance SiP.
Our State-of-the-Art stacking technology for SiP allow us to bring the best standard semiconductor devices and technology node in one single highly miniaturized package with almost no limit for the merging of heterogeneous technologies (die – package – passives).
3D PLUS provides four different very flexible Stack Technology Flows that can be used for the design of various styles of SiPs:
Depending on the SiP performance requirements and targeted market, the relevant stacking process will be selected within 3D PLUS technology portfolio in order to bring the best added value and benefits for our customer designs.
Achieving a combination that cannot be realized with monolithic System-on-Chip (SoC) approaches, and, relying on a proven “first time right” design and development methodology, 3D PLUS SiP stacks are more effective and have also a lower development cost and a faster time to market.
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Computer, Power and SiP Products P/N Decoder