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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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The CASPEX Space Camera Head family provides high resolution and high performance camera heads for space applications. Integrated using 3D PLUS packaging technology, each camera head embeds a high performance image sensor associated user-reconfigurable FPGA-based electronic architecture, allowing configurable embedded image processing and formatting for a versatile use.
The CASPEX SWIR Space Camera Head embeds all necessary components to operate its 1.3Mpx InGaAs SWIR image sensor and high performance FPGA-based architecture in a highly constrained space environment, including all DC-DC converters, processing and storage memories in a reduced volume of 40x40x45mm3. This camera module offers a configurable electrical interface through a 77-pins PGA matrix, including 22 LVDS pairs, a JTAG interface for FPGA configuration, and a 5V power supply interface, and compatible to the 12Mpx Space Camera Head. The CASPEX SWIR Space Camera Head design provides to the users a dedicated optical, mechanical and thermal interface for an optimal and easy integration in space optical instruments as well as a second thermal interface dedicated to the processing architecture, allowing a efficient separation between the sensing part and the processing part of the camera head.
The CASPEX SWIR Space Camera head is a generic product, suitable for multiple high performance space applications requiring SWIR sensibility such as scientific imaging (spectrometry, planetology), earth observation, navigation and rendezvous applications in constrained light environment.
All-in-one space qualified High resolution and high performance camera head :
High level of miniaturization and optimization :
Enhanced radiation performances :
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Camera Part Number Decoder
Camera evaluation kits are ready to use evaluation and prototyping environment compatible with 3D PLUS camera heads products, including hardware and software tools to support the use and integration of the camera heads. It allows configuration and operating of the camera heads in a test environment (instrument integration, optical bench, testing facilities).
3D PLUS space camera heads family offers several options for the configuration of its cameras, all compliant with ECSS-QST-60-02C ESA development standard
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.
