MNEMOSYNE Unveils SEE-Immune Memory ASIC at RADECS 2024

At the RADECS 2024 conference, the consortium under the EU-funded MNEMOSYNE project, introduced a significant advancement in radiation-hardened memory technology: a 128 Mbit ASIC Memory built using MRAM process technology, offering exceptional radiation resistance, critical for space applications.

Unparalleled Radiation Performances

This cutting-edge memory solution demonstrates exceptional radiation characteristics, making it an ideal choice for the demanding conditions of space. The ASIC showcases a Total Ionizing Dose (TID) resistance exceeding 100 krad(Si), along with robust resilience against various Single Event Effects (SEE), including:

• Single Event Latch-up (SEL)
• Single Event Upset (SEU)
• Single Event Functional Interrupt (SEFI)
• Single Event Transient (SET)

The Linear Energy Transfer (LET) thresholds for these effects surpass 85 MeV.cm²/mg, underscoring the memory’s superior radiation hardness.

Versatile Module Options from 3D PLUS

Leveraging its proprietary stacking technology, 3D PLUS offers multiple module options based on this radiation-tolerant, MNEMOSYNE SEE-immune ASIC. The available modules include:

• 3DMN128M08US1852: Features a 3.3V parallel EEPROM interface
• 3DMN512M08US4853: Offers a 1.8V SPI interface with 512 Mbit capacity
• 3DMN1G08US8854: Provides a 1.8V SPI interface with an impressive 1 Gbit capacity

These memory modules are non-volatile, high-density, and designed to withstand the harsh radiation environments of space.

Best-in-Class Configuration and Boot Memory Solution

The serial interface, single 1.8V supply, and exceptional radiation performance make these modules the premier choice for space-grade applications. They are particularly well-suited for next-generation space processors and FPGAs that require low-voltage I/O banks. By utilizing these modules, systems can achieve enhanced reliability and performance in extreme conditions.

MNEMOSYNE Project Consortium

MNEMOSYNE project consortium includes Radiation Effects and Space Electronics experts: 3D PLUS, IMEC, Univeristy of Padova (UPD), Beyond Gravity (former RUAG), NanoXplore and TRAD