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3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS is the world-leading supplier of advanced high-density 3D microelectronic products, bare die and wafer level stacking technology meeting the demand for high reliability.
Application
Aerospace
Defense & Security
Inventor of 3D stacked Electronics for Space
High quality Referential with ISO and Space Agencies certifications
Our Support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, system in packages, miniaturized
Over 25 years of flight heritage and more than 200 000 modules in Space.
Expertise in obsolescence management and long term supply
3D PLUS has developed a new space DDR4 Ecosystem that includes DDR4 memories, a DDR4 Termination Regulator and a Radiation Intelligent Memory Controller.
India’s Chandrayaan-3 space mission successfully landed on the moon’s south pole. 3D PLUS proudly participates to the success of the Chandrayaan-3 mission by providing highly reliable memories for the sensors and the data handling, including: SDRAM and EEPROM
After years of continuous improvement, 3D PLUS is proud to announce today that it has obtained the Committed CSR label at the confirmed level.
