3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS is the world-leading supplier of advanced high-density 3D microelectronic products, bare die and wafer level stacking technology meeting the demand for high reliability.
Defense & Security
Inventor of 3D stacked Electronics for Space
High quality Referential with ISO and Space Agencies certifications
Our Support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, system in packages, miniaturized
Over 25 years of flight heritage and more than 200 000 modules in Space.
Expertise in obsolescence management and long term supply
MNEMOSYNE is a project funded by the European Union as part of its policy to ensure its independence in space. The project, which started in 2019, is being carried out by a consortium led by 3D PLUS.
India’s Chandrayaan-3 space mission successfully landed on the moon’s south pole. 3D PLUS proudly participates to the success of the Chandrayaan-3 mission by providing highly reliable memories for the sensors and the data handling, including: SDRAM and EEPROM
3D PLUS presented the major achievement of the MNEMOSYNE development program at the 70th Space Component Technology Board meeting.