3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS standard products feature high density and high electrical performance.
They are used in high performance and advanced digital electronic applications where component density, data bus width (up to 128-bit wide) and operating frequency (up to 900MHz) require extensive design work and PWB layout simulations to check/verify signal integrity, EMI, and transition response.
The preferred simulation model for 3D PLUS Stacks is the IBIS Model (I/O Buffer Information Specification). It gives the behavioral description of the I/O buffers and package characteristics of a stack.
3D PLUS stacks IBIS models are non-coupled lumped LCR models derived from TDR measurements in order to reflect the exact characteristics of the 3D technology package and of the semiconductor devices embedded in the stack.
IBIS or EBD models are available on demand for standard products. Specific models can be developed on customers’ request.