This space-grade COnfiguration Memory BOot Manager COMBO is designed by 3D PLUS to meet the unique needs of the aerospace industry. The 3DCO0849 COMBO module, a cutting-edge solution for booting SRAM based FPGAs and MPSoCs with a large configuration memory.

With the COMBO module, you can boot SRAM based FPGAs using the smallest PCB footprint available in the market. It combines all the necessary hardware resources into a single module, providing a streamlined and efficient solution. The module also has the capability to store multiple large configuration bitstreams for FPGAs and their embedded processors, thanks to its integrated 64 Gb RT NAND Flash.

One of the key features of the COMBO module is its ability to facilitate on-orbit reconfiguration. This makes it an essential solution for applications where frequent updates and changes to the configuration are required. Whether you are working on satellite systems or other aerospace projects, the 3DCO0849 COMBO module offers the reliability and performance you need.

The COMBO module is designed with space-grade specifications, ensuring its durability and suitability for harsh environments. It is a reliable choice for mission-critical applications, providing the necessary booting and storage capabilities for SRAM based FPGAs and MPSoCs.

COMBO Part Number Decoder

Key features

  • Module Configuration

    Power Supply: 1.2V, 2.5V, 3.3V

    Temperature Range: -40°C to +105°C

    High level of miniaturization : 32 x 32 mm² area, 22 g


  • Radiation Performances

    TID > 50 krad (Si)

    SEL LET > 62.5 MeV.cm²/mg

  • Supporting different SRAM FPGA types

    AMD Xilinx Versal ACAP,

    AMD Xilinx Ultrascale / Ultrascale+,

    AMD Xilinx  7 Series, 6 Series, 5 Series,

    NanoXplore NG-ULTRA, ULTRA 300.

  • Storage capability

    Integrating a 64 Gb RT NAND Flash capable of storing multiple large configuration bitstreams for FPGAs and their embedded processors and data files.

  • Booting capability

    Booting SRAM based FPGAs from the required configuration image stored in the NAND Flash


  • Reliability performance

    Supporting functionalities to provide data integrity for stored bitstreams to achieve mission in space environment.

Key Benefits

  • High density full space grade solution to boot high- end SRAM based FPGAs



  • Multiple reliable bitstream images management with data integrity


  • Key solution for on-orbit reconfiguration


Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.

Product Part Number Description Package Temperature
COMBO 3DMCO0849 Space grade COnfiguration Memory BOot manager COMBO 483 balls BGA

Pitch 1,27mm

-40 °C to +105 °C



Product Part Number Flyer
COMBO 3DCO0849 Flyer PDF - 599ko Download