About Us Our expertise

Our 3D stacking technology: our expertise in electronic miniaturization

In embedded electronic systems, reducing space requirements is a major challenge.

Thanks to our patented 3D stacking technology, we push the boundaries of miniaturization by integrating multiple electronic components into a single module. This approach optimizes available space while ensuring a high level of performance and reliability.

Unlike traditional architectures where components are placed side by side on a printed circuit board, our technology relies on vertical stacking along the Z-axis.

Advanced Stacking Technology and Core Principles

3D stacking integration

Our work relies on the ability to integrate various types of electronic components within a single module:

• Active components;
• Passive components;
• Optoelectronic components;
• Bare dies;
• Packaged components.

This approach makes it possible to create compact electronic architectures tailored to the specific constraints of each design.

Core Principles of Our Technology

• 

  Multi-layer stacking

  Up to 10 semiconductors devices in an ultra-reduced thickness.

  • Increased functional density
  • Reduced footprint
• 

  Metal-Edge Bus Interconnect

  Our Metal-Edge Bus interconnect technology provides a connection between the different integration levels. This process helps to:

  • Reduce electrical distances
  • Improve signal integrity
  • Enhance resistance to environmental constraints
• 

  Testing and Qualification

  Each component and integration level undergoes testing prior to assembly. This approach guarantees:

  • Monitored yield
  • Consistent quality
  • Reliability tailored to critical environments

Our stacking processes

Key Benefits and Qualification

Key features of our technology

• Footprint reduction: our technology reduces the volume and weight of electronic systems compared to traditional solutions (up to a factor of 10 depending on the configuration).
• Electrical performance improvement: reducing interconnects limits parasitic effects and supports overall system performance.
• Reliability in demanding environments: our integration processes withstand the mechanical, thermal, and radiation constraints of numerous applications.
•  Design flexibility: our ability to integrate various components into a single module allows us to develop standard or customized solutions tailored to specific needs.

Space-qualified technology

Our 3D stacking technology is ESA-qualified for space applications (PID No. 3300-0546 Rev. 15). This qualification validates the manufacturing, assembly, and testing of our non-hermetic modules. Backed by our electronic integration expertise, we deliver compact, reliable, and high-tech solutions.