About Us Overview

3D PLUS is the world-leading supplier of advanced high-density 3D microelectronic products, bare die and wafer level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. Its patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and enables stacking heterogeneous active, passive and Opto-electronics.

Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components. It responds to a diverse range of needs and requirements going from low volume-space qualified up to high volume-industrial applications.

Benefiting from high Quality standards based on the ISO9001 certification, our 3D stacking technology is the sole worldwide qualified by the European Space Agency (ESA) and the French Space Agency (CNES) for Space applications.

Our Solutions

3D PLUS products are used in high technology industries such as aerospace, defense, security and avionics. With more than 200,000 modules in space, and more than 25 years of flight heritage with no reported failure, we provide the global space and defense industry for all types of applications: telecommunications, Earth observation, navigation, launch and manned space vehicles, science missions and constellations.


3D PLUS offers a wide range of catalog radiation tolerant products for space applications including Memories and IP cores, Computer Cores, Interfaces, POL converters, Radiation Protection ICs and Camera heads. Industrial memory and Custom System-In-Package (SiP) solutions are also available for our customers who want to shrink their design thanks to our State-of-the Art stacking technology and recognized design, manufacturing and test expertise.

3D PLUS products bring key advantages for our customers’ electronic designs:

  • High performance / high density / very high speed

  • High reliability / Rugged to extremely harsh environments and Space radiations

  • Extreme miniaturization / very small factor

  • Space qualification and very large flight heritage.

  • Long term availability


Capital :1,554,867

Incorporation date: October 1995
Shareholding structure: Subsidiary of the Electronics Technology Group of the HEICO Corporation (NYSE/HEI.A and HEI)
Workforce: 250 employees

3D PLUS SA Registration:
Versailles Trade & Companies Register N°. B 402 523 088
VAT N°: FR77402523088

3D PLUS USA Registration:
Cage Code: 3FBQ6
DUNS: 109955232

Export Control:

3D PLUS complies with all applicable export control laws and regulations.
3D PLUS catalog products and SiPs technology are not subject to US-Export Regulations such EAR and ITAR; They Can be delivered worldwide.

For activities requesting exchange of projects’ information with its US customers, 3D PLUS USA Inc. and 3D PLUS SA comply with the regulations of the International Traffic in Arms Regulation for non-classified programs. All employees are trained and comply with the document and data controls required by ITAR. 3D PLUS empowered Official is available at 3D PLUS USA to answer any compliance questions you might have



408 Rue Hélène Boucher-Zi
78530 BUC, France
PHONE : +33 (0) 130 832 650


151 Callan Ave. Suite 310
San Leandro CA 94577
Phone (CA) : +1 510 824 5591
Phone (TX) : +1 972 672 2865
Phone (MD) : +1 410 274 5200


Security and entrance procedure

Foreign National visitors are requested to provide detail personal information for security clearance at least one week prior to their visit. In order to gain access to 3D PLUS site, each visitor will have to check in at the visitor’s front desk and present a valid ID for registration.



The visitor’s badge shall be worn visibly at all times.
Overshoes for ESD protection and site cleanliness are delivered at the visitor’s front desk and shall be worn at all times while visiting our facility.

3D PLUS is a smoke-free facility. Smoking is only allowed outside the building in designated areas. The use of photo and video cameras is strictly forbidden while visiting 3D PLUS premises.


Directions and hotels nearby 3D PLUS Headquarters

Located in the south of Paris, near Versailles, our headquarters are within driving distance of all major Paris Area Airports and can also be reached by public transportation.

In anticipation of your visit, a selection of hotels nearby 3D PLUS and more information on how to reach us is available in our welcome pack here.