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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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PROM (Programmable Read-Only Memory) is a type of One-Time Programmable (OTP) non-volatile memory, a critical component for high-performance and high-reliability computer boards used in space applications. The 3D PLUS PROM stands out with its advanced features and robust performance.
3D PLUS PROMs are constructed using a rugged memory cell technology and manufactured on epitaxial semiconductor substrates. Leveraging the innovative 3D PLUS stacking process, these memory modules offer capacities up to 128 Mb in an SOP package. This design ensures high resistance for Surface Mount Technology (SMT) assembly, making these PROMs exceptionally durable against harsh thermal and mechanical environments found in space missions.
First released in 2013, the 3D PLUS PROM has proven to be an excellent fit for processor’s boot and program memory in various high-performance and high-reliability computer boards. Their resilience and reliability have been demonstrated in challenging space missions, including the ISS-ASIM Observatory and CYGNISS.
With a focus on Radiation Tolerant Space Memory and Rad-Hard Microelectronic Components, 3D PLUS ensures that their PROMs can withstand the unforgiving conditions of space. This makes them an ideal choice for critical space applications requiring dependable memory solutions.
Non volatile and One-Time Programmable
Serial or 8-bit parallel interface
20 years data retention
Worldwide delivery guarantee
Radiation tolerance:
TID > 50 krad (Si)
SEL Immune, LETth > 120 MeV.cm²/mg
SEU Immune, LETth > 120 MeV.cm²/mg
No pure tin guarantee
Flight heritage with technology proven for 15 to 18 years missions in space
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information. Memory Part Number Decoder
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