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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS will participate will be at RADECS Industrial Exhibitions! We will present "SEE Characterization of the 4 Tb 3DFN4T16LB1862 and 8 Tb 3DFN8T16LB2821 3D NAND flash memories for space application" during the poster session.
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Join 3D PLUS at the 25th European Microelectronics & Packaging Conference (ππππ ππππ) in Grenoble, France. We will be presenting at the ππππ ππππ conference on September 18, 2025, at 11:30 a.m. Jean-Michel Guinet will discuss "ππ’π π‘ πππ§π¬π’ππ² ππ π’π§πππ«ππ¨π§π§ππππ’π¨π§π¬ ππ¨π« π‘π’π π‘ π©ππ«ππ¨π«π¦ππ§ππ ππππ πππ¬ππ π-π«ππ²π¬ πππππππ¨π«π¬", a collaborative project by 3D PLUS, CEA, and CNES.
