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3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS is introducing 3DSD1G48VB2820, a new memory, to broaden their portfolio of space SDRAMs. Since its first release on the market in 2003, 3D PLUS space qualified SDRAMs have been used as processor RAM in a variety of high-performance computer boards, and as high-density storage memory in Solid State Data Recorder boards.
The 3D PLUS space SDRAMs have a distinctive flight heritage as they are used in a variety of space applications including science and deep space missions (e.g: Juno launched in 2011 by NASA), Earth observation (e.g: COSMO-SkyMed satellites with the first one launched in 2007), launchers (e.g: Ariane 5), navigation satellites (e.g: Galileo system). They are also used worldwide in missions such as BepiColombo, a jointly ESA and JAXA mission launched in 2018; EMM, a mission operated by the UAE agency MBRSC, and launched 2020 or Chandrayaan-3, launched in July 2023 by ISRO.
The 3DSD1G48VB2820 SDRAM module features 1.5 Gbit density with 48 bits data bus and 3.3V power supply. It is latch-up immune (SEL > 80 MeV.cm²/mg), and can withstand up to 50 krad (Si) of TID. First engineering parts will be available in June 2024 and the qualified flight grade parts are expected by September 2024.
