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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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DDR3 SDRAM is the upgrade of DDR2 Space Memory with higher speed and lower power consumption. From 16 Gb to 24 Gb, our Radiation Tolerant DDR3 SDRAM memories are organized as x16b, x48b or x72b, and with a 1.35 V or 1.5 V power supply. 3D PLUS DDR3 SDRAM space memories embed decoupling capacitors for excellent signal integrity and additional real estate savings on the users’ PCBs. They are offered in standard BGA package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.
Released on the space market in 2018, 3D PLUS DDR3 SDRAM products are used as processing memory in a variety of high performance computer boards for space applications. They operate synergistically in an Ecosystem with two additional elements, providing all-in-one, fully space qualified and radiation immune DDR3 memory solution. The DDR3 memory companion chips are:
3D PLUS DDR3 SDRAM space memory have been use in diverse missions such as: EMIT, and others.
1.5 V supply voltage, 1.35 V backward compatible
Up to 667 MT/s
Decoupling capacitors and termination resistors embedded
Significant board area savings
Optimized development time and cost
Long life cycle products with proven reliability in Space
No pure tin guarantee
Ruggedized, fully validated complete DDR3 solution
Radiation tolerance (stand alone):
TID > 75 krad(Si)
SEL LETth > 67 MeV.cm²/mg
SEU LETth : 0.4 MeV.cm²/mg ; σsat = 1.05E-11 cm²/bit
SEFI LETth : 0.4 MeV.cm²/mg ; σsat = 6.18E-6 cm²/device
Radiation tolerance (w. RIMC DDR3):
TID > 75 krad (Si)
SEU mitigation with 3DIPMC0744
SEFI protection with 3DIPMC0744
Available in all 3D PLUS screening and qualification options:
Commercial (C )
Industrial (I)
Space qualified (S)
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information. Memory Part Number Decoder