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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
Explore the 3DCO0849 COMBO, an advanced space-grade Configuration Memory Boot Manager by 3D PLUS. This innovative module efficiently configures SRAM-based FPGAs and MPSoCs, offering extensive storage, data integrity, and in-flight reconfiguration capabilities in a compact design.
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NASA's EZIE mission is advancing our understanding of space weather and its impact on Earth. Learn about the mission's goals and the technology behind it.
Discover the MCAM system by 3D PLUS, a standard multi-camera solution for space missions. Integrating up to seven IRIS cameras, it's ideal for lunar programs and harsh space environments.
Explore ESA's Biomass Mission, launched to monitor global forests using advanced satellite technology and 3D PLUS electronic components.
3D PLUS Names Pierre-Eric Berthet as New CEO and President, effective May 1, 2025.
Explore the 3D PLUS CASPEX family, high-performance camera heads designed for space imaging. Learn about their innovative features and applications.
