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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
On November 18, 2025, at Space Tech Expo Europe in Bremen, 3D PLUS presented ASTERIA, a space camera designed for imaging in exploration, surveillance, Earth observation, and scientific missions.
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Discover the NISAR Earth observation mission—a NASA & ISRO radar satellite tracking climate change, ice melt, and natural hazards. Learn how 3D PLUS memory supports space tech.
Developed in collaboration with CNES, 3D PLUS’s CASPEX 4M space camera has been selected to represent the Yvelines department at the 5th Grande Exposition du Fabriqué en France, held at the Élysée Palace on November 15-16, 2025.
MNEMOSYNE, the next-generation radiation-hardened memory family by 3D PLUS. Designed for space applications, these SEE-immune, high-reliability memories deliver >100 krad TID resistance and are now in full production.
NASA’s IMAP mission launched on September 24, heading to the Sun-Earth Lagrange point to study the heliosphere’s protective barrier. 3D PLUS contributes with DDR2 memory, LCL protection, and LVDS interfaces, ensuring mission reliability. This data will advance space weather research and support future deep-space exploration.
3D PLUS’s 4Tbit & 8Tbit NAND flash offers 60K P/E cycles, TID >25 krad, and 600 MHz ONFI 4.2 NV-DDR3 for satellites and New Space.
