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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
The first results from the Proba-3 mission, published in March 2026, have sent shockwaves through the scientific community. Data reveals that solar wind within the corona moves up to four times faster than previously estimated. Discover how this world-first artificial eclipse mission, supported by 3D PLUS high-reliability electronics, is redefining our understanding of space weather.
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Discover Curiosity's breakthroughs on Mars! 3D PLUS supports this historic mission by providing electronic components.
3D PLUS is proud to present the COMBO (3DCO0849), a new high-density boot manager for space applications. This all-in-one, radiation-tolerant module features 16 Gb of storage.
For the first time since 1972, humanity is returning to the Moon's proximity. We are proud to support Artemis II mission with our high-performance, space-qualified solutions. Our specialized memory modules are integrated into the Orion spacecraft, providing the reliability and radiation resistance required for critical systems as the crew ventures into deep space.
At SATShow 2026 in Washington, D.C., 3D PLUS officially reveals the ASTERIA space camera to our American customers. This ultra-compact 4K imaging solution delivers high-resolution performance with a reduced SWaP-C profile for satellite missions.
3D PLUS supports the Copernicus Sentinel-2 mission. From Stung Treng to Rosario, free satellite data facilitate the monitoring of environmental crises such as deforestation and drought.
