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3D PLUS has more than 220,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
After eight years in space, BepiColombo is arriving at Mercury. Discover the ESA–JAXA mission's goals and 3D PLUS's electronics contribution.
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The 3DPM0602 addresses the power requirements of the latest generations of FPGAs and microprocessors. It illustrates 3D PLUS's expertise in developing power solutions for space electronics.
In environments where cooling is limited or impossible, memory reliability becomes critical. The 3D PLUS 64-Gb High Temperature NAND Flash — two stacked chips, non-volatile, tested to withstand temperatures of up to 175°C — addresses the needs of Oil & Gas drilling and hot-zone avionics.
NASA's Nancy Grace Roman Space Telescope launched on August 2026. Discover 3D PLUS role in this historic mission.
MCAM provides a scalable infrastructure ready to support the imaging needs of next-generation space missions.
Discover how 3D PLUS supports NASA’s Juno and Europa Clipper missions to explore the Jupiter system and uncover planetary origins.
