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3D PLUS has more than 220,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
MCAM provides a scalable infrastructure ready to support the imaging needs of next-generation space missions.
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Discover how 3D PLUS supports NASA’s Juno and Europa Clipper missions to explore the Jupiter system and uncover planetary origins.
Discover FUSIO-RT (3DMC075), engineered for compact and reliable housekeeping functions in embedded space systems.
Learn about the Euclid telescope's 60-million-star mosaic of the Milky Way core and the 3D PLUS memory modules used to process and store the data.
Massive data processing is one of modern astronomy's greatest hurdles. Discover how NASA’s TESS mission pairs 3D PLUS onboard electronics with the RAVEN artificial intelligence to sort millions of cosmic images and fast-track the discovery of Earth-like worlds.
The SMILE space mission successfully launched on a Vega-C rocket to analyze solar wind-Earth interactions. A joint project between ESA and the Chinese Academy of Sciences, it features modules supplied by 3D PLUS.
