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3D PLUS has more than 220,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
Massive data processing is one of modern astronomy's greatest hurdles. Discover how NASA’s TESS mission pairs 3D PLUS onboard electronics with the RAVEN artificial intelligence to sort millions of cosmic images and fast-track the discovery of Earth-like worlds.
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Discover NAND Flash Memory (3DFN64G08VB1388). Engineered for extreme high temperatures and reliability in the harshest industrial environments.
The SMILE space mission successfully launched on a Vega-C rocket to analyze solar wind-Earth interactions. A joint project between ESA and the Chinese Academy of Sciences, it features modules supplied by 3D PLUS.
The first results from the Proba-3 mission, published in March 2026, have sent shockwaves through the scientific community. Data reveals that solar wind within the corona moves up to four times faster than previously estimated. Discover how this world-first artificial eclipse mission, supported by 3D PLUS high-reliability electronics, is redefining our understanding of space weather.
Discover Curiosity's breakthroughs on Mars! 3D PLUS supports this historic mission by providing electronic components.
3D PLUS is proud to present the COMBO (3DCO0849), a new high-density boot manager for space applications. This all-in-one, radiation-tolerant module features 16 Gb of storage.
