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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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Discover the Radiation Intelligent Memory Stack (RTIMS) Flash, a user-friendly, high-density, plug-and-play NAND Flash memory designed to provide radiation protection. This cutting-edge memory solution features an embedded Flash Memory Controller (FMC) and NAND Flash memories.
The NAND Flash memories used in RTIMS Flash are SLC-based, ensuring high performance and immunity to latch-up. The FMC offers comprehensive protection against Single Event Upsets (SEUs) through either Triple Modular Redundancy (TMR) or Error Detection And Correction (EDAC) methods. Additionally, the FMC includes current detection and power management to safeguard against high-current SEFi events.
First released in 2014, RTIMS Flash operates as a standard NAND Flash when connected to any processor or FPGA with a built-in NAND Flash interface. It is also widely used as a stand-alone local data recorder, thanks to its embedded functions like wear leveling and bad block management.
Explore the capabilities of RTIMS Flash for reliable, radiation-protected data storage in a variety of applications.
SLC memory technology
Bad block free – continuous logic sectors
100, 000 program/erase cycles capability
10 years data retention
Radiation tolerance:
TID > 50 krad (Si)
SEL LETth > 62.5 MeV.cm²/mg
SEU Immune (TMR or EDAC)
SET Immune by design
High Current SEFI Immune by design
No pure tin guarantee
Flight heritage with technology proven for 15 to 18 years missions in space
Worldwide delivery guarantee
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.
