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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
The 3DCO0849 COMBO is a space grade COnfiguration Memory BOot manager to configure and scrub high end SRAM-based FPGAs and MPSoCs requiring a large configuration memory.
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Labege, France and Miami, FL – HEICO Corporation today announced that its 3D PLUS subsidiary acquired TRAD SAS (“TRAD”) for all cash consideration paid at closing. 3D PLUS is part of HEICO’s Electronic Technologies Group. Further financial details were not disclosed.
Launched on October 16th 2021, Lucy is the first mission to the Trojan Asteroids. Mid-October, the probe started a long twelve-year journey to eight of Jupiter asteroids to understand solar system formation and evolution since the Big-Bang.
Sept. 26 2022. NASA’s DART mission successfully crashed into the asteroid Dimorphos and marked the beginning of what scientists call planetary defense.
The Radiation Tolerant Intelligent Memory Stack (RTIMS Flash) is a high density, user-friendly, off-the-shelf NAND Flash memory.
3D PLUS expands its Space Camera head Family by offering a high-density, high-performance 1.3 Mpixels SWIR Camera Head for space applications.
