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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS is thrilled to announce that the Chinese Chang´e 6 space mission, launched on May 3rd 2024, marks the first space flight heritage for our component FUSIO RT which integrates the NG-MEDIUM FPGA from NanoXplore
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3D PLUS develop its Space product line with the creation of a new product family: the IRIS camera family for space applications.
The 3DSD1G48VB2820 SDRAM space memory features 1.5 Gbit density with 48 bits data bus and 3.3V power supply.
3D PLUS took part in a meeting on the theme “Responsible Purchasing and Entrepreneurial Innovation”.
3D PLUS seeks to be able to improve our analysis skills and know-how to achieve the excellence of our products.
The Space Component Technology Board had its 70th meeting on January 25, 2024, an event where 3D PLUS presented the major achievement of the MNEMOSYNE development program. The conference was hosted by the European Commission.
