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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
Sept. 26 2022. NASA’s DART mission successfully crashed into the asteroid Dimorphos and marked the beginning of what scientists call planetary defense.
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The Radiation Tolerant Intelligent Memory Stack (RTIMS Flash) is a high density, user-friendly, off-the-shelf NAND Flash memory.
3D PLUS expands its Space Camera head Family by offering a high-density, high-performance 1.3 Mpixels SWIR Camera Head for space applications.
Artemis I is the first chapter in the new space race, a chapter named Moon. The launch of Artemis I on November 16, 2022, by the NASA marks the beginning in a series of complex missions that will enable human exploration to the Moon.
We are pleased to announce today that our project "NEMESI-X 1" has been selected by the State as a winner of the "Recovery Plan for Industry – Nuclear" call for projects.
HEICO Corporation today announced that its Electronic Technologies Group acquired the business, assets and certain liabilities of highly successful Pyramid Semiconductor LLC (“Pyramid”) from its founders for cash paid at closing.
