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News Press releases

  • Discover the Future of Space Imaging with 3D PLUS

    2025 . 21 . 02

    Explore the 3D PLUS CASPEX family, high-performance camera heads designed for space imaging. Learn about their innovative features and applications.

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  • 3D PLUS Celebrates 30 Years of Innovation and Hosts Worldwide Sales Meeting 2025

    2025 . 31 . 01

    On January 2025, 3D PLUS began its 30th anniversary celebration with a major event: the Worldwide Sales Meeting 2025.

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  • 3D PLUS Launches THE MCAM MULTI-CAMERA SYSTEM FOR SPACE APPLICATIONS

    2024 . 23 . 12

    3D PLUS is proud to expand its space camera portfolio with the introduction of the MCAM multi-camera system as a standard product offering, resulting from developments under the Mars Sample Return – Earth Return Orbiter (MSR-ERO) project.

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  • 3D PLUS and Pyramid Semiconductors Celebrate the Opening of New USA Offices in Sunnyvale

    2024 . 18 . 12

    The opening of our new USA offices in Sunnyvale, CA. 3D PLUS and Pyramid Semiconductors have moved to a new location at 1247 Reamwood Ave., enhancing collaboration and innovation. Learn more about our growth and commitment to serving our clients and partners from our new home.

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  • MNEMOSYNE Unveils SEE-Immune Memory ASIC at RADECS 2024

    2024 . 05 . 10

    Discover MNEMOSYNE's groundbreaking 128 Mbit ASIC Memory, unveiled at RADECS 2024. This radiation-hardened MRAM technology offers exceptional resistance, ideal for space applications.

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  • 3D PLUS Celebrates the Remarkable Legacy of the Cluster II Mission and the Reentry of Satellite Salsa

    2024 . 10 . 09

    3D PLUS Celebrates the Remarkable Legacy of the Cluster II Mission and the Reentry of Satellite Salsa. This mission was among the first to feature the 3D PLUS MCCS 640 Mb module, a System-in-Package (SiP) design created specifically for this project.

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