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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
Explore the 3D PLUS CASPEX family, high-performance camera heads designed for space imaging. Learn about their innovative features and applications.
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On January 2025, 3D PLUS began its 30th anniversary celebration with a major event: the Worldwide Sales Meeting 2025.
3D PLUS is proud to expand its space camera portfolio with the introduction of the MCAM multi-camera system as a standard product offering, resulting from developments under the Mars Sample Return – Earth Return Orbiter (MSR-ERO) project.
The opening of our new USA offices in Sunnyvale, CA. 3D PLUS and Pyramid Semiconductors have moved to a new location at 1247 Reamwood Ave., enhancing collaboration and innovation. Learn more about our growth and commitment to serving our clients and partners from our new home.
Discover MNEMOSYNE's groundbreaking 128 Mbit ASIC Memory, unveiled at RADECS 2024. This radiation-hardened MRAM technology offers exceptional resistance, ideal for space applications.
3D PLUS Celebrates the Remarkable Legacy of the Cluster II Mission and the Reentry of Satellite Salsa. This mission was among the first to feature the 3D PLUS MCCS 640 Mb module, a System-in-Package (SiP) design created specifically for this project.
