3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
The Space Component Technology Board had its 70th meeting on January 25, 2024, an event where 3D PLUS presented the major achievement of the MNEMOSYNE development program. The conference was hosted by the European Commission.
Mnemosyne is a non volatile memory asic. Using its stacking technology, 3D PLUS offers modules based on this SEE immune memory ASIC.
The 3DRC3508ES2861 is an ITAR Free Space grade octal 3-input high-speed Majority Voter with integrated built-in triple redundancy.
The 3DCO0849 COMBO is a space grade COnfiguration Memory BOot manager to configure and scrub high end
SRAM-based FPGAs and MPSoCs requiring a large configuration memory.
August 23, 2023. India’s Chandrayaan-3 space mission successfully landed on the moon’s south pole
Buc, France. Après des années d’amélioration continue, 3D PLUS est aujourd’hui fière d’annoncer l’obtention du label Engagé RSE niveau confirmé.