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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS expands its Space Camera head Family by offering a high-density, high-performance 1.3 Mpixels SWIR Camera Head for space applications. Thanks to 3D PLUS proven stacking technology and a srtong expertize in camera heads , the 3DCM830 SWIR Space Camera Head embeds a SWIR InGaAs image sensor with a high performance FPGA-based electronic architecture and associated memories. This device is fully space quaified and provides efficient and reliable image processing.
The 3DCM830 SWIR Space Camera Head is suitable for many scientific applications such as :
