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3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS is the world-leading supplier of advanced high-density 3D microelectronic products, stacking technology for bare chips and components to meet the demand for high reliability, high performance and very small size electronics.
Its 3D technology concept and innovation consist of interconnecting electronics devices which have been stacked along the Z dimension. As in the following illustration, the electronic devices are first placed horizontally alongside one another on a layer and internally connected. The layers are then stacked vertically and connected thanks to a vertical interconnection technique.
3D PLUS portfolio of patented and leading-edge stacking technologies starts with standard packages scale upward to die-size and wafer level stacking processes. Although the detailed process flow can be different, our stacking technology all rely on the same four principles keys :
(*) n-High means a stack of n levels.
They allow gaining a factor of at least 10 on size and weight of the components comparing to existing solutions, and with a capability of stacking up to 10 semiconductors devices within 1 mm, 3D PLUS Ultra Low Profile Module are unique.
Our technology offer responds to a diverse range of needs and requirements going from low volume-space qualified up to high volume-industrial applications. It is the only one in the world that is qualified for Space applications by the major Space Agencies ESA, NASA and JPL.
3D PLUS provides four different very flexible Stack Technology Flows
Standard packages stack
With the capability to stack n-High any standard packages from the industry, this process flow is based on very simple and well-proven technologies. A large products portfolio using this technology relies on TSOPs packages. This capability domain is also qualified by European Space Agency (ESA) for Space applications.
Flex Process-Die Stack
With the capability to stack n-High any non-modified standard die (even with different sizes and technology), this process flow enables to embed the best semiconductors together in one single highly miniaturized package. High reliability and resistance to harsh environments, and very good manufacturing yield are also key benefits of this die stacking technology.
Flex Process- SIP Stack
This process has the unique capability to stack n-High any heterogeneous active, passive and opto-electroniques devices in a single highly miniaturized package. This is the most efficient technology for the building complex System-in-Packages (SiPs). This capability domain is also qualified by European Space Agency (ESA) for Space Application.
Waffer Level Stack WDOD™
Based on the use of standard wafers (die without “TSV”), and with the capability to stack die with different sizes up to 10 levels, our wafer level stack technology named WDoD™ (Wirefree Die-on-Die) achieves smaller forms factors and Ultra Low Profile 3D stack.
Depending on the product’s performance requirements and targeted market, the relevant stacking process will be selected within 3D PLUS technology portfolio in order to bring the best added value and benefits for our customers designs.
