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3D PLUS a plus de 210 000 composants microélectroniques dans l’espace, et plus de 25 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
The 3D PLUS CASPEX family (CAmera heads for SPace EXploration) is a breakthrough serie of camera heads designed to elevate space imaging to new heights. Using 3D PLUS proven stacking technology and extensive experience in electronic module design and manufacturing, these high-performance camera heads are designed to meet the specific demands of space exploration.
Why Choose CASPEX? The CASPEX family integrates high-resolution image sensors with a radiation-hardened by design FPGA-based processing architecture, all within a compact module. This design ensures high reliability, genericity, and density, making CASPEX products ideal for space instrument cameras and their associated space constraints.
The CASPEX family is also at the core of our IRIS cameras, which combine our optoelectronic cores with optics and casing to provide full turn-key space camera solutions.
All CASPEX products are available in both engineering and flight grades, ensuring they meet the rigorous standards required for space missions.