3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
The Radiation Intelligent Memory Stack (RTIMS) Flash is a user-friendly, high density, plug-and-play, radiation-protected NAND Flash memory. Its embeds a Flash Memory Controller (FMC) and NAND Flash memories.
The NAND Flash memories embedded are SLC-based and latch-up immune. The FMC provides module full protection against SEU through TMR -Triple Modular Redundancy or EDAC-Error Detection And Correction. In addition, the protection against high-current SEFi is performed by current detection and power management controlled by the FMC.
First released in 2014, RTIMS Flash can be as a standard NAND Flash when connected to any any processor or FPGA with a built-in NAND Flash interface. It is also used as a small stand-alone local data recorder due to its high level embedded functions such as wear leveling, bad block management, etc.
SLC memory technology
Bad block free – continuous logic sectors
100, 000 program/erase cycles capability
10 years data retention
TID > 50 krad (Si)
SEL LETth > 62.5 MeV.cm²/mg
SEU Immune (TMR or EDAC)
SET Immune by design
High Current SEFI Immune by design
No pure tin guarantee
Flight heritage with technology proven for 15 to 18 years missions in space
Worldwide delivery guarantee
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.