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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
NanoXplore and 3D PLUS are proud to announce their involvement in the successful Chang’e 6 mission, which recently landed on the far side of the Moon. The mission, led by China, aimed to collect lunar samples and install scientific equipment on the Moon’s surface. Both the landing and the collection of samples were resounding successes, with the probe now back on Earth.
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3D PLUS is thrilled to announce that the Chinese Chang´e 6 space mission, launched on May 3rd 2024, marks the first space flight heritage for our component FUSIO RT which integrates the NG-MEDIUM FPGA from NanoXplore
3D PLUS develop its Space product line with the creation of a new product family: the IRIS camera family for space applications.
The 3DSD1G48VB2820 SDRAM space memory features 1.5 Gbit density with 48 bits data bus and 3.3V power supply.
3D PLUS took part in a meeting on the theme “Responsible Purchasing and Entrepreneurial Innovation”.
3D PLUS seeks to be able to improve our analysis skills and know-how to achieve the excellence of our products.
