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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
MNEMOSYNE, the next-generation radiation-hardened memory family by 3D PLUS. Designed for space applications, these SEE-immune, high-reliability memories deliver >100 krad TID resistance and are now in full production.
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NASA’s IMAP mission launched on September 24, heading to the Sun-Earth Lagrange point to study the heliosphere’s protective barrier. 3D PLUS contributes with DDR2 memory, LCL protection, and LVDS interfaces, ensuring mission reliability. This data will advance space weather research and support future deep-space exploration.
3D PLUS’s 4Tbit & 8Tbit NAND flash offers 60K P/E cycles, TID >25 krad, and 600 MHz ONFI 4.2 NV-DDR3 for satellites and New Space.
On July 1, 2025, the MTG-S1 satellite was launched to revolutionize weather prediction and climate monitoring. Equipped with advanced hyperspectral and air quality instruments, it provides real-time atmospheric data, improving storm detection and environmental insights. 3D PLUS memory solutions support this critical ESA mission.
Celebrate 30 years of 3D PLUS, pioneering technology in space and defense. Discover our journey of innovation and commitment to excellence.
Explore the 3DCO0849 COMBO, an advanced space-grade Configuration Memory Boot Manager by 3D PLUS. This innovative module efficiently configures SRAM-based FPGAs and MPSoCs, offering extensive storage, data integrity, and in-flight reconfiguration capabilities in a compact design.
