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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
The 3D PLUS CASPEX family (CAmera heads for SPace EXploration) is a breakthrough serie of camera heads designed to elevate space imaging to new heights. Using 3D PLUS proven stacking technology and extensive experience in electronic module design and manufacturing, these high-performance camera heads are designed to meet the specific demands of space exploration.
Why Choose CASPEX? The CASPEX family integrates high-resolution image sensors with a radiation-hardened by design FPGA-based processing architecture, all within a compact module. This design ensures high reliability, genericity, and density, making CASPEX products ideal for space instrument cameras and their associated space constraints.
The CASPEX family is also at the core of our IRIS cameras, which combine our optoelectronic cores with optics and casing to provide full turn-key space camera solutions.
All CASPEX products are available in both engineering and flight grades, ensuring they meet the rigorous standards required for space missions.
