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News Press releases

  • 3D PLUS Announces Pierre-Eric Berthet as New CEO

    2025 . 01 . 05

    3D PLUS Names Pierre-Eric Berthet as New CEO and President, effective May 1, 2025.

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  • Discover the Future of Space Imaging with 3D PLUS

    2025 . 21 . 02

    Explore the 3D PLUS CASPEX family, high-performance camera heads designed for space imaging. Learn about their innovative features and applications.

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  • 3D PLUS Celebrates 30 Years of Innovation and Hosts Worldwide Sales Meeting 2025

    2025 . 31 . 01

    On January 2025, 3D PLUS began its 30th anniversary celebration with a major event: the Worldwide Sales Meeting 2025.

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  • 3D PLUS Launches THE MCAM MULTI-CAMERA SYSTEM FOR SPACE APPLICATIONS

    2024 . 23 . 12

    3D PLUS is proud to expand its space camera portfolio with the introduction of the MCAM multi-camera system as a standard product offering, resulting from developments under the Mars Sample Return – Earth Return Orbiter (MSR-ERO) project.

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  • 3D PLUS and Pyramid Semiconductors Celebrate the Opening of New USA Offices in Sunnyvale

    2024 . 18 . 12

    The opening of our new USA offices in Sunnyvale, CA. 3D PLUS and Pyramid Semiconductors have moved to a new location at 1247 Reamwood Ave., enhancing collaboration and innovation. Learn more about our growth and commitment to serving our clients and partners from our new home.

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  • MNEMOSYNE Unveils SEE-Immune Memory ASIC at RADECS 2024

    2024 . 05 . 10

    Discover MNEMOSYNE's groundbreaking 128 Mbit ASIC Memory, unveiled at RADECS 2024. This radiation-hardened MRAM technology offers exceptional resistance, ideal for space applications.

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