News & Events
Welcome to 3D PLUS News & Events section where a variety of products and technology announcements, upcoming events and corporate news are presented. Don’t hesitate to contact us for more information.
We will be exhibiting with our partner MSA Components at the next Space Tech Expo Europe. A good opportunity to learn more about our fully integrated space Computer Core FUSIO RT and our innovative solutions dedicated to space field. You will also see a live demo of our space qualified camera. Visit us booth A20!
Meet our team booth 680 at the 70th International Astronautical Congress and learn more about our innovative solutions for space applications.
Don't miss us booth 206, we will be pleased to meet you and present all our new space products.
We are pleased to announce our participation to the International Paris Air Show. A great occasion to see our CMOS space camera in demonstartion! Visit our booth #F113 in the Hall 4. We look forward to meeting you.
30/07/2020 - Press release
We are proud to announce that NASA's Mars Rover Perseverance integrates multiple products such as volatile and non volatile memory modules, Latch-up Current Limiters, Interfaces and our CMOS space qualified camera head.
21/07/2020 - Press release
Multiple 3D PLUS' volatile and non volatile memories including SRAM, SDRAM and NAND Flash are embedded on board the Hope probe of the Emirates Mars Mission launched on the 19th of July 2020.
16/06/2020 - Press release
3D PLUS has developed a new space DDR4 Ecosystem including three types of DDR4 memories, a DDR4 Termination Regulator and a Radiation Intelligent Memory Controller (RIMC).
13/05/2020 - Press release
The 3D PLUS SMD assembly line has been certified and included in our PID 3300-0546-12 with the PCA-351A rev1.
07/02/2020 - Press release
3D PLUS has provided several miniaturized 3D PLUS products for multiple Solar Orbiter instruments. Consult our article to learn more.
02/07/2019 - Press release
Nous sommes fiers de vous annoncer que 3D PLUS reprend les actifs de la société BERNIER (Essonne), concepteur et fabriquant de connecteurs pour environnements sévères. BERNIER intègre donc le groupe HEICO. Cliquez pour afficher le communiqué de presse publié par Oaklins et en apprendre plus sur cette acquisition.
02/07/2019 - Press release
3D PLUS acquired substantially all of the assets and business of BERNIER, designer and manufacturer of connectors for harsh environments. We are proud to welcome BERNIER in the HEICO group.
Click to consult the HEICO press release to learn more about this acquisition.
04/03/2019 - Press release
OneWeb’s six first satellites have been successfully launched from Kourou, French Guiana, on February 27th
3D PLUS has developed the electronic module which embeds the acquisition functionalities of Auriga, the star tracker developed by Sodern. Auriga will equip all the OneWeb constellation.
27/11/2018 - Press release
3D PLUS has provided multiple memory moduly (NAND Flash, NOR Flash, SDRAM, SRAM, EEPROM) on-board InSight lander and MarCO A and B CubSats built by JPL.
23/10/2018 - Press release
3D PLUS supplied several memory modules (SRAM, EEPROM and SDRAM), POL Converters and custom low noise amplifier for BepiColombo, a joint mission of JAXA and ESA, launched on October 20th.
09/10/2018 - Press release
3D PLUS has supplied high performance memory modules to Mitsubishi Electric Corporation and received the Best Supplier Award of the year.
03/10/2018 - Press release
After a 4 years trip in space, MASCOT successfully landed on Ryugu’s south hemisphere. 3D PLUS supplied high density radiation tolerant modules integrated in the MASCOT's data acquisition and mass memory board and the on-board computer.
23/11/2017 - Press release
DEVELOPMENT AND APPLICATION TECHNOLOGY VOLUME HYBRID INTEGRATED CIRCUITS IN SPACECRAFT REMOTE SENSING OF THE EARTH
Consult our article about the technologies of creation and application of new highly reliable hybrid assemblies for use in spacecraft of Earth remote sensing and radio equipment orbital groups.
17/07/2017 - Press release HEICO
HEICO CEO Laurans A. Mendelson named to French Legion of Honor.
Consult the press release.
18/04/2017 - Press release
Pascal Couderc, 3D PLUS' Research and Development Manager, deals with the Wire-free Die-on-die Technology in 3D InCities.
09/03/2017 - Press release
We are proud to announce that our 4Mb EEPROM and 4Gb SDRAM are embedded abroad Sentinel-2B, the second Sentinel-2 satellite.
20/02/2017 - Press release
The STP-H5/ISEM (STP-Houston 5, ISS SpaceCube Experiment Mini) payload includes four different types of onboard computers that integrate 3D PLUS’ parts.
16/12/2016 - Press Release
3D PLUS is proud to announce that some of its highly reliable and radiation tolerant memory modules are used in CYGNSS (Cyclone Global Navigation Satellite System), the NASA's hurricane prediction mission launched yesterday.
26/09/2016 - Press Release
3D PLUS annouces its participation in NASA's OSIRIS-REx mission providing 256Mb NOR Flash and 4Gb SDRAM, used in the avionics for the spacecraft.
30/06/2016 - Press Release
We are very proud to announce you that 3D PLUS USA received the Supplier Trust and Recognition Award from NASA JPL for providing outstanding customer service by going above and beyond to support JPL mission success.
29/06/2016 - Press Release CNES
3D PLUS latest-generation space qualified 4 Mp CMOS Camera to fly to the Moon in 2017 with the Team Indus mission
French Space Agency CNES and Indian firm Axiom Research Labs signed an agreement to contribute to the Team Indus mission that is set to land a module and rover on the Moon in 2017. France will supply latest-generation CMOS micro-cameras developed in partnership with French firm 3D PLUS.
02/06/2016 - Press Release
3D PLUS unveils its partnership with Sodern for the supply of camera modules embedded in constellations and small-sat star tracker applications
3D PLUS announces a partnership with Sodern for the design and manufacturing of camera modules to be integrated in the Auriga star tracker targeted for constellations and small-sat applications
Inventor of 3D stacked Electronics for Space
High Quality referential with ISO and Space Agencies Certifications
Our support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, System in Packages, miniaturized
Over 16 years of flight heritage and 100 000 modules in Space