News & Events

21/04/2023 -

JUICE: In its way to Jupiter

3D PLUS proudly participates to the success of the JUICE mission by providing highly reliable memories, including: -NAND FLASH
-SDRAM
-EEPROM
-SRAM
-MRAM

17/11/2022 - PRESS RELEASE

ARTEMIS I: WE ARE GOING TO THE MOON

3D PLUS proudly participates to the success of the Artemis I mission by providing highly reliable modules, including: 

-NAND FLASH
-SDRAM
-EEPROM
-NOR FLASH
-LVDS

03/10/2022 - PRESS RELEASE

3D PLUS, HEICO subsidiary, acquires TRAD

“We became well-acquainted with TRAD as a customer over
many years in which we were deeply impressed by their services and software which
we used for our own components that we make for satellites and spacecraft. This
relationship and 3D PLUS’ experience with TRAD led to a mutual desire between TRAD
and 3D PLUS for the company to be acquired by 3D PLUS. We are eager to be joined
and to do exceptional work together.” Pierre Maurice, Co-Founder and CEO OF 3D PLUS

27/09/2022 - PRESS RELEASE

DART MISSION: The Beginning of the Planetary Defense

3D PLUS contributes to the DART mission with multiple components such as MRAM memories onboard DART, but also in its companionship, LiciaCube nanosat, manufactured by ARGOTEC, that integrates highly reliable memory modules such as SDRAM, FLASH NAND and EEPROM and the 4Mpx Monochrome Camera.

10/11/2021 - Press release

3D PLUS part of LUCY mission

3D PLUS, contributes to LUCY mission to Trojan asteroids, launched on October 16th 2021, with multiple components.

20/07/2021 - Press release

FR - L'ETAT SOUTIENT 3D PLUS DANS LE DEVELOPPEMENT DU PROJET "NEMESI-X 1"

Depuis la crise sanitaire de mars 2020, l'Etat français met en place des dispositifs particuliers pour aider les entreprises, les salariés et pour relancer l'économie. Le projet de 3D PLUS « NEMESI-X 1 » a été sélectionné par l’Etat comme lauréat de l‘appel à projet « Plan de relance pour l’industrie – Nucléaire ». Par conséquent, l’Etat soutient l'investissement de 3D PLUS dans ce projet à hauteur de 471 333€.

17/03/2021 - Press release

FIRST IMAGES OF SUPERCAM WITH 3D PLUS CMOS CAMERA

Perseverance delivered its first pictures from SuperCam instrument, taken with the unique 3D PLUS CMOS space camera!
Consult our article to learn more.

09/03/2021 - Press release HEICO

HEICO CORPORATION ACQUIRES PYRAMID SEMICONDUCTOR

HEICO Corporation Electronic Technologies Group acquired the business of Pyramid Semiconductor LLC, that will operate as part of 3D PLUS USA.

19/02/2021 - Press release

3D PLUS MODULES REACHED MARS SURFACE

NASA's Perseverance rover integrates multiple 3D PLUS reliable components, including our unique CMOS space grade camera head inside the SuperCam instrument. 3D PLUS also provided numerous memories, interfaces and LCL embedded in several instruments.

07/12/2020 - Press release

3D PLUS CONTRIBUTES TO THE SUCCESS OF HAYABUSA 2 MISSION

JAXA's Hayabusa 2 spacecraft integrates 3D PLUS highly reliable memory modules, including SDRAM, SRAM and EEPROM.

24/11/2020 - Press release

3D PLUS SUPPLIED MEMORIES FOR CHANG'E 5 LUNAR MISSION

3D PLUS technology, a key factor to the success of the Chang'e 5 lunar samples return mission.

30/07/2020 - Press release

3D PLUS has supplied a large number of electronic components for the NASA's Perseverance Mars Rover

We are proud to announce that NASA's Mars Rover Perseverance integrates multiple products such as volatile and non volatile memory modules, Latch-up Current Limiters, Interfaces and our CMOS space qualified camera head.

21/07/2020 - Press release

3D PLUS provided memories for the Emirates Mars Mission

Multiple 3D PLUS' volatile and non volatile memories including SRAM, SDRAM and NAND Flash are embedded on board the Hope probe of the Emirates Mars Mission launched on the 19th of July 2020.

23/02/2021 - Press release

3D PLUS announces upcoming DDR4 full ecosystem for space

3D PLUS has developed a new space DDR4 Ecosystem including three types of DDR4 memories, a DDR4 Termination Regulator and a Radiation Intelligent Memory Controller (RIMC). 

13/05/2020 - Press release

ESCC PROCESS CAPABILITY APPROVAL

The 3D PLUS SMD assembly line has been certified and included in our PID 3300-0546-12 with the PCA-351A rev1.

07/02/2020 - Press release

Solar Orbiter will embed multiple 3D PLUS' products

3D PLUS has provided several miniaturized 3D PLUS products for multiple Solar Orbiter instruments. Consult our article to learn more.

02/07/2019 - Press release OAKLINS

FR - 3D PLUS REPREND LES ACTIFS DE LA SOCIETE BERNIER

Nous sommes fiers de vous annoncer que 3D PLUS reprend les actifs de la société BERNIER (Essonne), concepteur et fabriquant de connecteurs pour environnements sévères. BERNIER intègre donc le groupe HEICO.  Cliquez pour afficher le communiqué de presse publié par Oaklins et en apprendre plus sur cette acquisition.

02/07/2019 - Press release HEICO

3D PLUS ACQUIRED BERNIER COMPANY

3D PLUS acquired substantially all of the assets and business of BERNIER, designer and manufacturer of connectors for harsh environments. We are proud to welcome BERNIER in the HEICO group. 

Click to consult the HEICO press release to learn more about this acquisition.

04/03/2019 - Press release

OneWeb’s six first satellites have been successfully launched from Kourou, French Guiana, on February 27th

3D PLUS has developed the electronic module which embeds the acquisition functionalities of Auriga, the star tracker developed by Sodern. Auriga will equip all the OneWeb constellation.

27/11/2018 - Press release

3D PLUS high tolerant modules on-board NASA's InSight lander

3D PLUS has provided multiple memory moduly (NAND Flash, NOR Flash, SDRAM, SRAM, EEPROM) on-board InSight lander and MarCO A and B CubSats built by JPL.

23/10/2018 - Press release

3D PLUS supplied several electronic modules for BepiColombo, Europe's first mission to Mercury

3D PLUS supplied several memory modules (SRAM, EEPROM and SDRAM), POL Converters and custom low noise amplifier for BepiColombo, a joint mission of JAXA and ESA, launched on October 20^th.

09/10/2018 - Press release

3D PLUS has received MELCO's Best Supplier Award of the year

3D PLUS has supplied high performance memory modules to Mitsubishi Electric Corporation and received the Best Supplier Award of the year.

03/10/2018 - Press release

3D PLUS has supplied several electronic parts for Hayabusa2/MASCOT mission.

After a 4 years trip in space, MASCOT successfully landed on Ryugu’s south hemisphere. 3D PLUS supplied high density radiation tolerant modules integrated in the MASCOT's data acquisition and mass memory board and the on-board computer.

23/11/2017 - Press release

DEVELOPMENT AND APPLICATION TECHNOLOGY VOLUME HYBRID INTEGRATED CIRCUITS IN SPACECRAFT REMOTE SENSING OF THE EARTH

Consult our article about the technologies of creation and application of new highly reliable hybrid assemblies for use in spacecraft of Earth remote sensing and radio equipment orbital groups.

17/07/2017 - Press release HEICO

HEICO News

HEICO CEO Laurans A. Mendelson named to French Legion of Honor.

Consult the press release.

18/04/2017 - Press release

Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices

Pascal Couderc, 3D PLUS' Research and Development Manager, deals with the Wire-free Die-on-die Technology in 3D InCities.

09/03/2017 - Press release

Sentinel-2B, the second satellite of ESA's Sentinel-2 mission, integrates 3D PLUS' memory modules

We are proud to announce that our 4Mb EEPROM and 4Gb SDRAM are embedded abroad Sentinel-2B, the second Sentinel-2 satellite.

20/02/2017 - Press release

3D PLUS' memory modules aboard the SpaceX CRS-10 mission

The STP-H5/ISEM (STP-Houston 5, ISS SpaceCube Experiment Mini) payload includes four different types of onboard computers that integrate 3D PLUS’ parts.

16/12/2016 - Press Release

Once again, a NASA's mission includes 3D PLUS' modules

3D PLUS is proud to announce that some of its highly reliable and radiation tolerant memory modules are used in CYGNSS (Cyclone Global Navigation Satellite System), the NASA's hurricane prediction mission launched yesterday.

26/09/2016 - Press Release

3D PLUS modules launched aboard NASA's OSIRIS-REx spacecraft

3D PLUS annouces its participation in NASA's OSIRIS-REx mission providing 256Mb NOR Flash and 4Gb SDRAM, used in the avionics for the spacecraft.

30/06/2016 - Press Release

3D PLUS USA received the 2016 Supplier Trust and Recognition Award from NASA JPL

We are very proud to announce you that 3D PLUS USA received the Supplier Trust and Recognition Award from NASA JPL for providing outstanding customer service by going above and beyond to support JPL mission success.

29/06/2016 - Press Release CNES

3D PLUS latest-generation space qualified 4 Mp CMOS Camera to fly to the Moon in 2017 with the Team Indus mission

French Space Agency CNES and Indian firm Axiom Research Labs signed an agreement to contribute to the Team Indus mission that is set to land a module and rover on the Moon in 2017. France will supply latest-generation CMOS micro-cameras developed in partnership with French firm 3D PLUS.

02/06/2016 - Press Release

3D PLUS unveils its partnership with Sodern for the supply of camera modules embedded in constellations and small-sat star tracker applications

3D PLUS announces a partnership with Sodern for the design and manufacturing of camera modules to be integrated in the Auriga star tracker targeted for constellations and small-sat applications