EN FR
3D PLUS has more than 220,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
Modern tactical applications, such as missile guidance units, smart munitions, and advanced defense systems, face increasingly stringent size, weight, and power (SWaP) constraints. In many cases, these applications do not require the level of radiation tolerance associated with long-duration space missions. They do, however, require reliable and deterministic execution of housekeeping functions, including startup supervision, power sequencing, thermal management, and telemetry data logging.
Conventional implementations rely on several discrete components, including an FPGA, configuration Flash memory, working memory, and processing resources. This architecture increases PCB area, adds routing complexity, and raises the number of interconnections.
The FUSIO-RT combines these functions within a single 32 × 32 mm System-in-Package (SiP). This approach simplifies board design and addresses the space constraints of embedded systems.
The FUSIO-RT offers several features for tactical applications:
The FUSIO-RT is available in four variants. This product range allows memory capacity to match application requirements while preserving a common hardware architecture.
For development activities, the 3DEV075x FUSIO-RT Development Kit provides quick access to the development environment. Engineering teams can evaluate software, verify key functions, and complete application validation before final hardware production.
