3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
From 512 Mb to 4 Gb, our Radiation Tolerant SDRAM stacks enable high-density and high-speed data transfer solutions. The 3.3 V powered memories feature a wide range of data bus widths: x8b, x16b, x32b, x40b or x64b. They are offered in compact SOP, BGA or QFP package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.
First released in 2003, 3D PLUS SDRAM products are used as processor RAM in a variety of high performance computer boards, and as high density storage memory in Solid State Data Recorder boards. Their use in diverse fields of space applications such as science and deep space missions, Earth observation, launchers and manned space vehicles, navigation satellites, etc. , provides a unique flight heritage. These memory modules have been used on missions such as MSL, Juno, Exomars 2016, Parker Solar Probe, Chandrayaan-3, and others.
Highest density – smallest footprint (more than 85 % space savings in the design)
High speed up to 133 MHz
Wide data bus up to x64
TID > 50 krad(Si)
SEL LETth > 80 MeV.cm²/mg
SEU LETth : 7 MeV.cm²/mg ;
σsat = 2E-10 cm²/bit
Space quality level and very large flight heritage worldwide
No pure tin guarantee (less than 97% tin guarantee)
Very long life time electronics (technology proven for 15 to 18 years missions in space)
Worldwide delivery guarantee
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
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