3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
MNEMOSYNE aka the memory goddess is a non volatile memory ASIC derived from a project with the same name. The MNEMOSYNE project funded by EU’s program H2020 and launched in 2019 aimed to develop a non volatile memory with serial interface designed space constraints, with guaranteed supply chain (entirely manufactured in Europe). The memory ASIC designed was cross validated by a consortium of radiation effects and space electronics experts. More details on the EU project follow the link here
MNEMOSYNE modules are stacks of SEE (latch-up, upset, SEFI, transient) immune ASICs designed with the 22 nm STT-MRAM FDSOI process. Our radiation tolerant memory modules feature high density, high endurance, long time data retention and serial or parallel interface. The modules are offered in SOP or BGA package for high resistance Surface Mount (SMT) assembly and for withstanding harsh thermal and mechanical environments.
The Release to the market is scheduled for Q4’2023. MNEMOSYNE products are the best in class regarding reliability and density. They are perfectly suited for being used as configuration solution for the latest SRAM-based FPGAs or as boot/program code storage for leading processors.
Interfaces (only one at time):
SPI, DSPI, QSPI, OSPI for serial interface
EEPROM for parallel interface
1.8 V & 3.3 V
TID > 100 krad(Si)
SEL LETth > 60 MeV.cm²/mg @ 125 °C
SEU LETth > 60 MeV.cm²/mg
SET LETth > 60 MeV.cm²/mg
SEFI LETth > 60 MeV.cm²/mg
Operating temperature: -55 °C to +125 °C
Endurace: 100, 000 P/E cycles
Data retention: 20 years
Worldwide Delivery Guaranty
Space grade high density configuration memory –
Up to 1 Gb of SEE Immune Storage
Best in class regarding reliability
(data retention, P/E cycles, radiation)
Ease customers life with
additional features for
error management strategy
(ECC_flag, errors counters)
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
1.8 V SPI interface