3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
Electrically Erasable and Programmable ROM (EEPROM) enable on-board and in-orbit programming capability as non volatile memories. Based on the very rugged NMOS memory cell technology, our Radiation Tolerant EEPROM stacks feature high endurance and high data retention time. The 3.3 V or 5.0 V powered memories feature a wide range of data bus widths: x8b, x32b or x40b. They are offered in compact SOP package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.
Released in 2003, 3D PLUS EEPROM products are used as processor’s Boot and Program ROM in a variety of high performance computer boards. Their use in diverse fields of space applications such as science and deep space missions, Earth observation, launchers and manned space vehicles, navigation satellites, etc. , provides a unique flight heritage. These memory modules have been used on missions such as Exomars 2016, Change’5, H-IIA/H-IIB, Chandrayaan-3, Orion Artemis, and others.
EEPROM is not recommended for new design, instead we recommend MRAM which is a high speed, unlimited read and write endurance and non- volatile random access memory. EEPROM and MRAM memories are both byte-addressed, with active LOW control signals. It means that both protocols are basically compatible. Our MRAM memories present excellent radiation performances , thus they are suitable to replace our EEPROM memories.
High density – smallest footprint (more than 85 % area savings on board)
Wide data bus up to x40
Parallel access interface
10, 000 Write/Erase cycles capability
10 years data retention
> 80 krad(Si) (Read)
> 25 krad(Si) (Write)
SEL LETth > 80 MeV.cm²/mg
> 80 MeV.cm²/mg (Standby)
>25 MeV.cm²/mg (Read);
σsat = 1e-05 cm²/device
>10 MeV.cm²/mg (Write);
σsat = 5e-04 cm²/device
Space quality level and very large flight heritage worldwide
No pure tin guarantee (less than 97% tin guarantee)
Long life cycle products with proven reliability in Space
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.
The youngest-ever moon samples returned to Earth
It was the fifth lunar exploration mission of the Chinese Lunar Exploration Program, and China's first lunar sample-return mission.